SP232AEP-L MaxLinear IC DVR/RCVR RS232 LP 16DIP

label:
2024/07/10 213

• Operates from a Single +5V Power Supply
• Meets all RS-232F and ITU V.28 Specifications
• Operates with 0.1μF Ceramic Capacitors
• High Data rate - 120kbps under load
• Low power CMOS Operation
• +/-2kV Human Body Model ESD Protection
• Lead Free packaging available
CATALOG
SP232AEP-L COUNTRY OF ORIGIN
SP232AEP-L LIFECYCLE
SP232AEP-L PARAMETRIC INFO
SP232AEP-L PACKAGE INFO
SP232AEP-L MANUFACTURING INFO
SP232AEP-L EACD MODELS



COUNTRY OF ORIGIN
Taiwan (Province of China)



LIFECYCLE
Obsolete
Jan 11,2018
PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 2
Number of Receivers 2
Data Transmission Topology Point-to-Point
Transmitter Signal Type Single-Ended
Receiver Signal Type Single-Ended
Transmitter Communication Type RS-232
Charge Pump Yes
Number of External Capacitors 4
External Capacitor Capacitance (uF) 0.1
Channel Operating Mode Full Duplex
Receiver Communication Type RS-232
Input Logic Level TTL|CMOS
Output Logic Level TTL|CMOS
Interface Standards EIA/TIA-232|ITU-T V.28
Number of Transmitter Enables 0
Number of Receiver Enables 0
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 240Kbps
Driving Mode No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Typical Single Supply Voltage (V) 5
Minimum Single Supply Voltage (V) 4.5
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 5



PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 16
Lead Shape Through Hole
PCB 16
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 19.18
Package Width (mm) 6.35
Package Height (mm) 3.3
Package Diameter (mm) N/R
Package Overall Length (mm) 19.18
Package Overall Width (mm) 10.92(Max)
Package Overall Height (mm) 5.33(Max)
Seated Plane Height (mm) 5.33(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec MS-001BB
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy

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