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• 20Mbps RS-485 and 1Mbps RS-232 Data Rates
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• Pin-Selectable 250kbps Slew Limiting
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• Single Supply Operation from +3V to +5.5V
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• 1.65V to 5.5V Logic Interface VL pin
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• 2 Drivers, 2 Receivers RS-232/V.28
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• RS-485/422 Enhanced Receiver Fail-safe for open,shorted, or terminated but idle inputs
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CATALOG |
SP330EEY-L/TR COUNTRY OF ORIGIN
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SP330EEY-L/TR PARAMETRIC INFO
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SP330EEY-L/TR PACKAGE INFO
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SP330EEY-L/TR MANUFACTURING INFO
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SP330EEY-L/TR PACKAGING INFO
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SP330EEY-L/TR ECAD MODELS
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SP330EEY-L/TR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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Function |
Line Transceiver |
Number of Transceivers |
1 |
Number of Transmitters |
1@RS-422|1@RS-485|2@RS-232 |
Number of Receivers |
1@RS-422|1@RS-485|2@RS-232 |
Data Transmission Topology |
Point-to-Point|Multidrop|Multipoint |
Transmitter Signal Type |
Single-Ended|Differential |
Receiver Signal Type |
Single-Ended|Differential |
Transmitter Communication Type |
RS-232|RS-422|RS-485 |
Receiver Communication Type |
RS-232|RS-422|RS-485 |
Interface Standards |
EIA/TIA-485 |
Number of Transmitter Enables |
1 |
Number of Receiver Enables |
1 |
Number of Drivers per Line |
1@RS-232|1@RS-422|256@RS-485 |
Number of Receivers per Line |
1@RS-232|10@RS-422|256@RS-485 |
Data Rate |
20Mbps(Min) |
Driving Mode |
3-State |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Power Supply Type |
Single |
Typical Single Supply Voltage (V) |
3.3|5 |
Minimum Single Supply Voltage (V) |
3 |
Maximum Single Supply Voltage (V) |
5.5 |
Maximum Supply Current (mA) |
4.5 |
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PACKAGE INFO
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Supplier Package |
TSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
24 |
Lead Shape |
Gull-wing |
PCB |
24 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
7.8 |
Package Width (mm) |
4.4 |
Package Height (mm) |
1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
7.8 |
Package Overall Width (mm) |
6.4 |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Thin Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-153AD |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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ECAD MODELS
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APPLICATIONS |
• Software Programmable Serial Ports(RS-232, RS-422, RS-485) |
• Industrial and Single Board Computers |
• Industrial and Process Control Equipment |
• Point-Of-Sale Equipment |
• HVAC Controls and Networking Equipment |
• Building Security and Automation |
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