SP330EEY-L/TR MaxLinear IC TXRX RS232/485 24TSSOP

label:
2025/07/18 0
SP330EEY-L/TR MaxLinear IC TXRX RS232/485 24TSSOP


• 20Mbps RS-485 and 1Mbps RS-232 Data Rates
• Pin-Selectable 250kbps Slew Limiting
• Single Supply Operation from +3V to +5.5V
• 1.65V to 5.5V Logic Interface VL pin
• 2 Drivers, 2 Receivers RS-232/V.28
• RS-485/422 Enhanced Receiver Fail-safe for open,shorted, or terminated but idle inputs


CATALOG
SP330EEY-L/TR COUNTRY OF ORIGIN
SP330EEY-L/TR PARAMETRIC INFO
SP330EEY-L/TR PACKAGE INFO
SP330EEY-L/TR MANUFACTURING INFO
SP330EEY-L/TR PACKAGING INFO
SP330EEY-L/TR ECAD MODELS
SP330EEY-L/TR APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 1@RS-422|1@RS-485|2@RS-232
Number of Receivers 1@RS-422|1@RS-485|2@RS-232
Data Transmission Topology Point-to-Point|Multidrop|Multipoint
Transmitter Signal Type Single-Ended|Differential
Receiver Signal Type Single-Ended|Differential
Transmitter Communication Type RS-232|RS-422|RS-485
Receiver Communication Type RS-232|RS-422|RS-485
Interface Standards EIA/TIA-485
Number of Transmitter Enables 1
Number of Receiver Enables 1
Number of Drivers per Line 1@RS-232|1@RS-422|256@RS-485
Number of Receivers per Line 1@RS-232|10@RS-422|256@RS-485
Data Rate 20Mbps(Min)
Driving Mode 3-State
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Typical Single Supply Voltage (V) 3.3|5
Minimum Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 4.5


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 24
Lead Shape Gull-wing
PCB 24
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 7.8
Package Width (mm) 4.4
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 7.8
Package Overall Width (mm) 6.4
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AD
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel


ECAD MODELS



APPLICATIONS
• Software Programmable Serial Ports(RS-232, RS-422, RS-485)
• Industrial and Single Board Computers  
• Industrial and Process Control Equipment
• Point-Of-Sale Equipment
• HVAC Controls and Networking Equipment
• Building Security and Automation
Продукт RFQ