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• High performance 64 MHz e200z0h CPU– 32-bit Power Architecture® technology CPU– Up to 60 DMIPs operation– Variable length encoding (VLE)
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• Memory– Up to 1.5 MB on-chip Code Flash with ECC– 64 KB on-chip Data Flash with ECC– Up to 96 KB on-chip SRAM with ECC– 8-entry MPU
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• Interrupts– 16 priority levels– Non-maskable interrupt (NMI)– Up to 51 external interrupts lines including 27 wake-up lines
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| • 16-channel eDMA (linked to PITs, DSPI,ADCs, eMIOS, LINFlex and I2C) |
| • GPIOs: 77 (LQFP100), 121 (LQFP144) and 149 (LQFP176) |
| • Timer units– 8-channel 32-bit periodic interrupt timer– 4-channel 32-bit system timer– System watchdog timer– Real-time clock timer |
| • eMIOS, 16-bit counter timed I/O units– Up to 64 channels with PWM/MC/IC/OC– Up to 10 counter basis– ADC diagnostic trigger via CTU |
| • One 10-bit and one 12-bit ADC with up to 53 channels– Extendable to 81 channels– Individual conversion registers |
| • Dedicated diagnostic module for lighting– Advanced PWM generation– Time-triggered diagnostics– PWM-synchronized ADC measurements |
| • Cross triggering unit (CTU) |
| • On-chip CAN/UART bootstrap loader |
| • Communications interfaces– Up to 6 FlexCAN (2.0B active) with 64 message buffers each– Up to 10 LINFlex/UART channels– Up to 6 buffered DSPI channels– I2C interface |
| • Clock generation– 4 to 16 MHz fast external crystal oscillator– 32 kHz slow external crystal oscillator– 16 MHz fast internal RC oscillator– 128 kHz slow internal RC oscillator for lowpower modes– Software-controlled FMPLL– Clock monitoring unit |
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| CATALOG |
| SPC560B64L3B6E0X COUNTRY OF ORIGIN |
SPC560B64L3B6E0X PARAMETRIC INFO
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SPC560B64L3B6E0X PACKAGE INFO
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SPC560B64L3B6E0X MANUFACTURING INFO
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SPC560B64L3B6E0X PACKAGING INFO
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SPC560B64L3B6E0X EACD MODELS
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| COUNTRY OF ORIGIN |
| Malta |
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PARAMETRIC INFO
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| Family Name |
MPC56xx |
| Data Bus Width (bit) |
32 |
| Device Core |
e200z0h |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
64 |
| Program Memory Type |
Flash |
| Program Memory Size |
1.5MB |
| RAM Size |
96KB |
| Maximum CPU Frequency (MHz) |
64 |
| Number of Programmable I/Os |
77 |
| Number of Timers |
2 |
| ADC Channels |
19/7/19/5 |
| ADC Resolution (bit) |
10/10/12/12 |
| Core Architecture |
e200 |
| Number of ADCs |
Quad |
| Watchdog |
1 |
| Interface Type |
CAN/I2C/SCI/SPI |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
1 |
| I2S |
0 |
| UART |
0 |
| USART |
0 |
| CAN |
6 |
| USB |
0 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
3|4.5 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
3.6|5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
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PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
100 |
| Lead Shape |
Gull-wing |
| PCB |
100 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
14 |
| Package Width (mm) |
14 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
16 |
| Package Overall Width (mm) |
16 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BED |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Lead Finish(Plating) |
Matte Sn annealed |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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