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      • Magnetic shield type wound inductor for power circuits using a metallic magnetic material 
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      • Low-profile product. 
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      • Compared to ferrite wound type inductors, it is possible to achieve large current, low Rdc, and compactness 
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      • Low inductance variance in high-temperature environments with good DC superimposition characteristics. 
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      • Metallic magnetic material is used, and the structure has an integrated molded coil, so hum noise is lower than with core adhesive coils. 
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      • Operating temperature range: –40 to +125 °C (including self-temperature rise) 
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      | CATALOG | 
    
    
      SPM4012T-4R7M-LR COUNTRY OF ORIGIN 
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      SPM4012T-4R7M-LR PARAMETRIC INFO 
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      SPM4012T-4R7M-LR PACKAGE INFO 
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      SPM4012T-4R7M-LR MANUFACTURING INFO 
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      SPM4012T-4R7M-LR PACKAGING INFO 
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      SPM4012T-4R7M-LR APPLICATION 
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      COUNTRY OF ORIGIN 
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      China 
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      PARAMETRIC INFO 
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            | Type | 
            Power | 
           
          
            | Technology | 
            Wirewound | 
           
          
            | Protection Style | 
            Shielded | 
           
          
            | Core Material | 
            Metal | 
           
          
            | Inductance (H) | 
            4.7u | 
           
          
            | Tolerance | 
            20% | 
           
          
            | Inductance Test Frequency (Hz) | 
            100K | 
           
          
            | Maximum DC Current (A) | 
            1.7(Typ) | 
           
          
            | Typical Temperature Rise (°C) | 
            40 | 
           
          
            | Maximum Saturation Current (A) | 
            3.3(Typ) | 
           
          
            | Maximum DC Resistance (Ohm) | 
            0.1967 | 
           
          
            | Inductance Decrease Percentage @ Isat (%) | 
            30 | 
           
          
            | Maximum Operating Temperature (°C) | 
            125 | 
           
          
            | Minimum Operating Temperature (°C) | 
            -40 | 
           
          
            | Operating Temperature (°C) | 
            -40 to 125 | 
           
        
       
       
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      PACKAGE INFO 
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            | Case Size | 
            N/A | 
           
          
            | Maximum Product Length (mm) | 
            4.6 | 
           
          
            | Maximum Product Depth (mm) | 
            4.3 | 
           
          
            | Maximum Product Height (mm) | 
            1.2 | 
           
          
            | Maximum Product Diameter (mm) | 
            N/R | 
           
          
            | Number of Terminals | 
            2 | 
           
          
            | Product Weight (g) | 
            0.0941 | 
           
          
            | Terminal Pitch (mm) | 
            N/R | 
           
          
            | Mounting | 
            Surface Mount | 
           
          
            | Product Diameter (mm) | 
            N/R | 
           
        
       
       
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      MANUFACTURING INFO 
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            | MSL | 
            1 | 
           
          
            | Maximum Reflow Temperature (°C) | 
            260 | 
           
          
            | Reflow Solder Time (Sec) | 
            10 | 
           
          
            | Reflow Temp. Source | 
            Link to Datasheet | 
           
          
            | Maximum Wave Temperature (°C) | 
            N/R | 
           
          
            | Wave Solder Time (Sec) | 
            N/R | 
           
          
            | Lead Finish(Plating) | 
            N/A | 
           
          
            | Under Plating Material | 
            N/A | 
           
          
            | Terminal Base Material | 
            N/A | 
           
        
       
       
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      PACKAGING INFO 
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            | Packaging Suffix | 
            T | 
           
          
            | Packaging | 
            Tape and Reel | 
           
          
            | Quantity Of Packaging | 
            1000 | 
           
          
            | Packaging Document | 
            Link to Datasheet | 
           
        
       
       
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      APPLICATION 
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      • Tablet terminals, note PCs, HDDs, servers, VRMs, compact power supply modules, other 
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      | • Application guides: Smart phones/tablets | 
    
    
       
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