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• Single Voltage Read and Write Operations:- 2.7V-3.6V or 2.3V-3.6V
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• High-Speed Clock Frequency:- 2.7V-3.6V: 104 MHz maximum- 2.3V-3.6V: 80 MHz maximum
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• Burst Modes:- Continuous linear burst- 8/16/32/64 Byte linear burst with wrap-around
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• Low-Power Consumption:- Active Read current: 15 mA (typical @ 104 MHz)- Standby Current: 15 µA (typical)
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| CATALOG |
SST26VF032BT-104I/SM COUNTRY OF ORIGIN
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SST26VF032BT-104I/SM PARAMETRIC INFO
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SST26VF032BT-104I/SM PACKAGE INFO
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SST26VF032BT-104I/SM MANUFACTURING INFO
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SST26VF032BT-104I/SM PACKAGING INFO
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SST26VF032BT-104I/SM ECAD MODELS
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COUNTRY OF ORIGIN
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Thailand
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PARAMETRIC INFO
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| Density (bit) |
32M |
| Cell Type |
NOR |
| Interface Type |
Serial (SPI, Dual SPI, Quad SPI) |
| Block Organization |
Symmetrical |
| Boot Block |
Yes |
| Timing Type |
Synchronous |
| Architecture |
Sectored |
| Programmability |
Yes |
| Typical Operating Supply Voltage (V) |
3|3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Number of Bits per Word (bit) |
1/2/4 |
| Number of Words |
32M/16M/8M |
| Location of Boot Block |
Bottom|Top |
| Maximum Operating Current (mA) |
20 |
| Programming Voltage (V) |
2.7 to 3.6 |
| Sector Size |
4Kbyte x 1024 |
| Program Current (mA) |
25 |
| Address Width (bit) |
32 |
| Minimum Operating Supply Voltage (V) |
2.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Erase Time (s) |
0.05/Chip |
| Maximum Programming Time (ms) |
1.5/Page |
| Command Compatible |
No |
| ECC Support |
No |
| Erase Suspend/Resume Modes Support |
Yes |
| Simultaneous Read/Write Support |
No |
| Support of Common Flash Interface |
No |
| Support of Page Mode |
No |
| Page Size |
256byte |
| Minimum Endurance (Cycles) |
100000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Density in Bits (bit) |
33554432 |
| Process Technology |
CMOS |
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PACKAGE INFO
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| Supplier Package |
SOIJ |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5.26 |
| Package Width (mm) |
5.25 |
| Package Height (mm) |
1.98(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
EIAJ Small Outline IC |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2100 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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