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• Organized as 128K x8 / 256K x8 / 512K x8
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• Single Voltage Read and Write Operations– 3.0-3.6V for SST39LF010/020/040– 2.7-3.6V for SST39VF010/020/040
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• Superior Reliability– Endurance: 100,000 Cycles (typical)– Greater than 100 years Data Retention
|
• Low Power Consumption(typical values at 14 MHz)– Active Current: 5 mA (typical)– Standby Current: 1 µA (typical)
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|
| CATALOG |
SST39VF040-70-4I-WHE COUNTRY OF ORIGIN
|
| SST39VF040-70-4I-WHE LIFECYCLE |
SST39VF040-70-4I-WHE PARAMETRIC INFO
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SST39VF040-70-4I-WHE PACKAGE INFO
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SST39VF040-70-4I-WHE MANUFACTURING INFO
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SST39VF040-70-4I-WHE PACKAGING INFO
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SST39VF040-70-4I-WHE ECAD MODELS
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|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
| LIFECYCLE |
Obsolete
Sep 15,2024 |
|
PARAMETRIC INFO
|
| Density (bit) |
4M |
| Cell Type |
NOR |
| Interface Type |
Parallel |
| Block Organization |
Symmetrical |
| Boot Block |
No |
| Timing Type |
Asynchronous |
| Architecture |
Sectored |
| Maximum Access Time (ns) |
70 |
| Programmability |
Yes |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Number of Bits per Word (bit) |
8 |
| Number of Words |
512K |
| Maximum Supply Current (mA) |
20 |
| Programming Voltage (V) |
2.7 to 3.6 |
| Sector Size |
4Kbyte x 128 |
| OE Access Time (ns) |
35 |
| Program Current (mA) |
30 |
| Address Width (bit) |
19 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Erase Time (s) |
0.1/Chip |
| Maximum Programming Time (ms) |
0.02/Byte |
| Command Compatible |
Yes |
| ECC Support |
No |
| Erase Suspend/Resume Modes Support |
No |
| Simultaneous Read/Write Support |
Yes |
| Support of Common Flash Interface |
No |
| Support of Page Mode |
No |
| Minimum Endurance (Cycles) |
10000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Density in Bits (bit) |
4194304 |
| Process Technology |
CMOS |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
Gull-wing |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
8.1(Max) |
| Package Width (mm) |
12.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-142BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Packaging Document |
Link to Datasheet |
|
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ECAD MODELS
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