|
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• 3 A DC output current
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• Operating input voltage from 5.5 V to 48 V
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• 850 kHz internally fixed switching frequency
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• Internal soft-start
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• Power good open collector output
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• Current mode architecture
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• Embedded compensation network
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• Zero load current operation
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• Internal current limiting
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• Inhibit for zero current consumption
|
• 2 mA maximum quiescent current over temperature range
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• 250 mΩ typ. RDS(on)
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• Thermal shutdown
|
|
| CATALOG |
ST1S14PHR COUNTRY OF ORIGIN
|
ST1S14PHR PARAMETRIC INFO
|
ST1S14PHR PACKAGE INFO
|
ST1S14PHR MANUFACTURING INFO
|
ST1S14PHR PACKAGING INFO
|
ST1S14PHR ECAD MODELS
|
ST1S14PHR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Type |
Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
5.5 |
| Maximum Input Voltage (V) |
48 |
| Output Voltage (V) |
1.22(Min) |
| Maximum Output Current (A) |
3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switching Frequency (kHz) |
1000 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
5.5 to 48 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
1700 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
HSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.7(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Factory automation |
| • Printers |
| • DC-DC modules |
| • High current LED drivers |
| |
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