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| CATALOG |
ST25DV04K-IER6C3 COUNTRY OF ORIGIN
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ST25DV04K-IER6C3 PARAMETRIC INFO
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ST25DV04K-IER6C3 PACKAGE INFO
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ST25DV04K-IER6C3 MANUFACTURING INFO
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ST25DV04K-IER6C3 PACKAGING INFO
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ST25DV04K-IER6C3 ECAD MODELS
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COUNTRY OF ORIGIN
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Philippines
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PARAMETRIC INFO
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| Technology |
Passive |
| Style |
IC |
| Memory Size |
4Kbit |
| Frequency Range (kHz) |
13553 to 13567 |
| Data Retention (Year) |
40(Typ) |
| Number of Overwrites (Times) |
1000000(Typ) |
| Supplier Temperature Grade |
Industrial |
| Anti-Collision Option |
Yes |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Operation |
Read/Write |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| RF Type |
NFC |
| Protocols Supported |
ISO 15693 |
| NFC Forum Tags |
Type 5 |
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PACKAGE INFO
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| Supplier Package |
UFDFPN |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Package Length (mm) |
2 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.53 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Ultra Thin Fine Pitch Dual Flat Package No Lead |
| Package Family Name |
DFN |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
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ECAD MODELS
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One-stop supplier of IC products