 |
|
| ■ Low quiescent current: 300 µA |
| ■ Designed for RS-485 interface application |
| ■ - 7 V to 12 V common mode input voltage range |
| ■ Driver maintains high impedance in 3-state or
with the power OFF |
| ■ 70 mV typical input hysteresis
|
| ■ 30 ns propagation delay, 5 ns skew |
| ■ Operate from a single 5 V supply |
| ■ Current limiting and thermal shutdown for
driver overload protection |
| ■ Allows up to 64 transceivers on the bus |
|
| CATALOG |
| ST485BDR COUNTRY OF ORIGIN |
| ST485BDR PARAMETRIC INFO |
| ST485BDR PACKAGE INFO |
| ST485BDR MANUFACTURING INFO |
| ST485BDR PACKAGING INFO |
| ST485BDR ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Morocco |
| Thailand |
| China |
| Malaysia |
| Philippines |
|
| PARAMETRIC INFO |
| Function |
Line Transceiver |
| Number of Transceivers |
1 |
| Number of Transmitters |
1 |
| Number of Receivers |
1 |
| Data Transmission Topology |
Multidrop|Multipoint |
| Transmitter Signal Type |
Differential |
| Receiver Signal Type |
Differential |
| Transmitter Communication Type |
RS-422|RS-485 |
| Charge Pump |
No |
| Receiver Communication Type |
RS-422|RS-485 |
| Channel Operating Mode |
Half Duplex |
| Interface Standards |
RS-422|RS-485 |
| Number of Transmitter Enables |
1 |
| Number of Receiver Enables |
1 |
| Number of Drivers per Line |
1@RS-422|32@RS-485 |
| Number of Receivers per Line |
1@RS-422|32@RS-485 |
| Data Rate |
2.5Mbps |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
5 |
| Minimum Single Supply Voltage (V) |
4.75 |
| Maximum Single Supply Voltage (V) |
5.25 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SO N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.65(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13(Max) |
| Reel Width (mm) |
12.4|13 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
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| |
|
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