
|
|
• Low quiescent current: 300 µA
|
• Designed for RS-485 interface application
|
• - 7 V to 12 V common mode input voltage range
|
• Driver maintains high impedance in 3-state or
with the power OFF
|
• 70 mV typical input hysteresis
|
• 30 ns propagation delay, 5 ns skew
|
• Operate from a single 5 V supply
|
• Current limiting and thermal shutdown for
driver overload protection
|
|
CATALOG |
ST485CDR COUNTRY OF ORIGIN
|
ST485CDR PARAMETRIC INFO
|
ST485CDR PACKAGE INFO
|
ST485CDR MANUFACTURING INFO
|
ST485CDR PACKAGING INFO
|
ST485CDR ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
China
|
Morocco
|
|
PARAMETRIC INFO
|
Function |
Line Transceiver |
Number of Transceivers |
1 |
Number of Transmitters |
1 |
Number of Receivers |
1 |
Data Transmission Topology |
Multidrop|Multipoint |
Transmitter Signal Type |
Differential |
Receiver Signal Type |
Differential |
Transmitter Communication Type |
RS-422|RS-485 |
Charge Pump |
No |
Receiver Communication Type |
RS-422|RS-485 |
Channel Operating Mode |
Half Duplex |
Interface Standards |
RS-422|RS-485 |
Number of Transmitter Enables |
1 |
Number of Receiver Enables |
1 |
Number of Drivers per Line |
1@RS-422|32@RS-485 |
Number of Receivers per Line |
1@RS-422|32@RS-485 |
Data Rate |
2.5Mbps |
Driving Mode |
3-State |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
70 |
Supplier Temperature Grade |
Commercial |
Power Supply Type |
Single |
Typical Single Supply Voltage (V) |
5 |
Minimum Single Supply Voltage (V) |
4.75 |
Maximum Single Supply Voltage (V) |
5.25 |
|
|
PACKAGE INFO
|
Supplier Package |
SO N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.65(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
|
|
ECAD MODELS
|

|
|