ST485CDR STMicroelectronics IC TXRX 5V RS485/422 LP 8-SOIC

label:
2023/10/27 259



• Low quiescent current: 300 µA
• Designed for RS-485 interface application
• - 7 V to 12 V common mode input voltage range
• Driver maintains high impedance in 3-state or with the power OFF
• 70 mV typical input hysteresis
• 30 ns propagation delay, 5 ns skew
• Operate from a single 5 V supply
• Current limiting and thermal shutdown for driver overload protection


CATALOG
ST485CDR COUNTRY OF ORIGIN
ST485CDR PARAMETRIC INFO
ST485CDR PACKAGE INFO
ST485CDR MANUFACTURING INFO
ST485CDR PACKAGING INFO
ST485CDR ECAD MODELS


COUNTRY OF ORIGIN
China
Morocco


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 1
Number of Receivers 1
Data Transmission Topology Multidrop|Multipoint
Transmitter Signal Type Differential
Receiver Signal Type Differential
Transmitter Communication Type RS-422|RS-485
Charge Pump No
Receiver Communication Type RS-422|RS-485
Channel Operating Mode Half Duplex
Interface Standards RS-422|RS-485
Number of Transmitter Enables 1
Number of Receiver Enables 1
Number of Drivers per Line 1@RS-422|32@RS-485
Number of Receivers per Line 1@RS-422|32@RS-485
Data Rate 2.5Mbps
Driving Mode 3-State
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Power Supply Type Single
Typical Single Supply Voltage (V) 5
Minimum Single Supply Voltage (V) 4.75
Maximum Single Supply Voltage (V) 5.25


PACKAGE INFO
Supplier Package SO N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.65(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 1000


ECAD MODELS


Продукт RFQ