ST8024CDR STMicroelectronics IC SMARTCARD 28SOIC

label:
2025/09/12 42
ST8024CDR STMicroelectronics 	IC SMARTCARD 28SOIC


• Designed to be compatible with the NDS conditional access system
• IC card interface
• 3 or 5 V supply for the IC (VDD and GND)
• Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts C4, C7 and C8
• DC-DC converter for VCC generation separately powered from a 5 V ± 20% supply (VDDP and PGND)


CATALOG
ST8024CDR COUNTRY OF ORIGIN
ST8024CDR PARAMETRIC INFO
ST8024CDR PACKAGE INFO
ST8024CDR MANUFACTURING INFO
ST8024CDR PACKAGING INFO
ST8024CDR ECAD MODELS


COUNTRY OF ORIGIN
Philippines
Italy
Malaysia


PARAMETRIC INFO
Maximum Operating Supply Voltage (V) 6.5
Minimum Operating Supply Voltage (V) 2.7
Maximum Supply Current (mA) 1.5
Maximum Clock Frequency (MHz) 20
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 150
Supplier Temperature Grade Industrial
Maximum Power Dissipation (mW) 560


PACKAGE INFO
Supplier Package SO
Basic Package Type Lead-Frame SMT
Pin Count 28
Lead Shape Gull-wing
PCB 28
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 18.1(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.35(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.65(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet
 
ECAD MODELS
Продукт RFQ