|
| |
• Single-Supply: 2.7V to 6.0V
|
• Rail-to-Rail Output
|
• Input Range Includes Ground
|
| • Gain Bandwidth Product: 2.8 MHz (typical) |
| • Unity-Gain Stable |
| • Low Quiescent Current: 230 µA/amplifier (typical) |
| • Chip Select (CS): MCP603 only |
| • Temperature Ranges:- Industrial: -40°C to +85°C- Extended: -40°C to +125°C |
| • AEC-Q100 Qualified. See Product Identification System (Automotive). |
| |
| CATALOG |
| STBC08PMR COUNTRY OF ORIGIN |
STBC08PMR PARAMETRIC INFO
|
STBC08PMR PACKAGE INFO
|
STBC08PMR MANUFACTURING INFO
|
STBC08PMR PACKAGING INFO
|
STBC08PMR EACD MODELS
|
| STBC08PMR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Thailand |
| China |
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
Linear Battery Charger |
| Battery Type |
Li-Ion |
| Output Voltage (V) |
4.2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
4.25 |
| Operating Supply Voltage (V) |
4.25 to 6.5 |
| Maximum Operating Supply Voltage (V) |
6.5 |
| Maximum Supply Current (mA) |
0.5 |
| Output Current (mA) |
800(Max) |
|
|
PACKAGE INFO
|
| Supplier Package |
DFN |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
No Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead |
| Package Family Name |
DFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| •
Cellular phones
|
| • PDAs |
| • Bluetooth® applications |
| • Battery-powered devices |
| |
One-stop supplier of IC products