STD4NK80ZT4 STMicroelectronics MOSFET N-CH 800V 3A DPAK

label:
2025/05/15 3
STD4NK80ZT4 STMicroelectronics MOSFET N-CH 800V 3A DPAK


• Extremely high dv/dt capability
• 100% avalanche tested
• Gate charge minimized
• Very low intrinsic capacitances
• Very good manufacturing repeatibility


CATALOG
STD4NK80ZT4 COUNTRY OF ORIGIN
STD4NK80ZT4 PARAMETRIC INFO
STD4NK80ZT4 PACKAGE INFO
STD4NK80ZT4 MANUFACTURING INFO
STD4NK80ZT4 PACKAGING INFO
STD4NK80ZT4 ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 800
Maximum Continuous Drain Current (A) 3
Maximum Gate Source Voltage (V) ±30
Maximum Drain Source Resistance (mOhm) 3500@10V
Typical Gate Charge @ Vgs (nC) 22.5@10V
Operating Junction Temperature (°C) -55 to 150
Typical Gate Charge @ 10V (nC) 22.5
Maximum Power Dissipation (mW) 80000
Process Technology SuperMESH
Category Power MOSFET
Maximum Positive Gate Source Voltage (V) 30
Typical Input Capacitance @ Vds (pF) 575@25V
Maximum Diode Forward Voltage (V) 1.6
Typical Turn-On Delay Time (ns) 13
Typical Turn-Off Delay Time (ns) 35
Typical Fall Time (ns) 32
Typical Rise Time (ns) 12
Maximum Gate Threshold Voltage (V) 4.5
Number of Elements per Chip 1
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Industrial


PACKAGE INFO
Supplier Package DPAK
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.3(Max)
Package Length (mm) 6.6(Max)
Package Width (mm) 6.2(Max)
Package Height (mm) 2.4(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6.6(Max)
Package Overall Width (mm) 10.1(Max)
Package Overall Height (mm) 2.63(Max)
Seated Plane Height (mm) 2.63(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Deca Watt Package
Package Family Name TO-252
Jedec TO-252AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Suffix T4
Packaging Tape and Reel
Quantity Of Packaging 2500
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ