
|
|
• Designed for automotive applications and AEC-Q101 qualified
|
• 180 mJ of avalanche energy @ TC = 150 °C,L = 3 mH
|
• ESD gate-emitter protection
|
• Gate-collector high voltage clamping
|
• Logic level gate drive
|
• Logic level gate drive
|
• High pulsed current capability
|
• Gate and gate-emitter resistor
|
|
CATALOG |
STGD18N40LZT4 COUNTRY OF ORIGIN
|
STGD18N40LZT4 PARAMETRIC INFO
|
STGD18N40LZT4 PACKAGE INFO
|
STGD18N40LZT4 MANUFACTURING INFO
|
STGD18N40LZT4 PACKAGING INFO
|
STGD18N40LZT4 ECAD MODELS
|
STGD18N40LZT4 APPLICATION
|
|
COUNTRY OF ORIGIN
|
Singapore
|
China
|
Italy
|
|
PARAMETRIC INFO
|
Channel Type |
N |
Configuration |
Single |
Maximum Collector-Emitter Voltage (V) |
360 |
Maximum Continuous Collector Current (A) |
30 |
Maximum Power Dissipation (W) |
125 |
Maximum Gate Emitter Voltage (V) |
12 |
Typical Collector Emitter Saturation Voltage (V) |
1.35 |
Maximum Gate Emitter Leakage Current (uA) |
830 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
175 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
175 |
Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
Supplier Package |
DPAK |
Pin Count |
3 |
Lead Shape |
Gull-wing |
PCB |
2 |
Tab |
Tab |
Pin Pitch (mm) |
2.3(Max) |
Package Length (mm) |
6.6(Max) |
Package Width (mm) |
6.2(Max) |
Package Height (mm) |
2.4(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
6.6(Max) |
Package Overall Width (mm) |
10.1(Max) |
Package Overall Height (mm) |
2.63(Max) |
Seated Plane Height (mm) |
2.63(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Deca Watt Package |
Package Family Name |
TO-252 |
Jedec |
TO-252AA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
NiP |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
Packaging Suffix |
T4 |
Packaging |
Tape and Reel |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS |
|
|
APPLICATION |
• Pencil coil electronic ignition driver |
|