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• Core: Arm® 32-bit Cortex®-M0 CPU, frequency
up to 48 MHz
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• Memories
– 16 to 256 Kbytes of Flash memory
– 4 to 32 Kbytes of SRAM with HW parity
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• CRC calculation unit
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• Reset and power management
– Digital & I/Os supply: VDD = 2.4 V to 3.6 V
– Analog supply: VDDA = VDD to 3.6 V
– Power-on/Power down reset (POR/PDR)
– Low power modes: Sleep, Stop, Standby
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• Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x6 PLL option
– Internal 40 kHz RC oscillator
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• Up to 55 fast I/Os
– All mappable on external interrupt vectors
– Up to 55 I/Os with 5V tolerant capability
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• 5-channel DMA controller
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•One 12-bit, 1.0 µs ADC (up to 16 channels)
– Conversion range: 0 to 3.6 V
– Separate analog supply: 2.4 V to 3.6 V
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• Calendar RTC with alarm and periodic wakeup
from Stop/Standby
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• 11 timers
– One 16-bit advanced-control timer for
six-channel PWM output
– Up to seven 16-bit timers, with up to four
IC/OC, OCN, usable for IR control
decoding
– Independent and system watchdog timers
– SysTick timer
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• Communication interfaces
– Up to two I2C interfaces
– Fast Mode Plus (1 Mbit/s) support on
one or two I/Fs, with 20 mA current sink
– SMBus/PMBus support (on single I/F)
– Up to six USARTs supporting master
synchronous SPI and modem control; one
with auto baud rate detection
– Up to two SPIs (18 Mbit/s) with 4 to 16
programmable bit frames
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• Serial wire debug (SWD)
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• All packages ECOPACK®2
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| CATALOG |
STM32F030F4P6 COUNTRY OF ORIGIN
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STM32F030F4P6 PARAMETRIC INFO
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STM32F030F4P6 PACKAGE INFO
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STM32F030F4P6 MANUFACTURING INFO
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STM32F030F4P6 PACKAGING INFO
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STM32F030F4P6 ECAD MODELS
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COUNTRY OF ORIGIN
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China
|
Philippines
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|
PARAMETRIC INFO
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| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Family Name |
STM32F |
| Device Core |
ARM Cortex M0 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
48 |
| Program Memory Type |
Flash |
| Program Memory Size |
16KB |
| RAM Size |
4KB |
| DMA Channels |
5 |
| Direct Memory Access |
Yes |
| Floating Point Unit |
No |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Internal/External Clock Type |
Internal/External |
| Touch Sensing Interface |
No |
| Power On Reset |
Yes |
| Memory Protection Unit |
No |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Maximum CPU Frequency (MHz) |
48 |
| Number of Programmable I/Os |
15 |
| Number of Timers |
5 |
| ADC Channels |
11 |
| ADC Resolution (bit) |
12 |
| Core Architecture |
ARM |
| Number of ADCs |
Single |
| Watchdog |
1 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Interface Type |
I2C/SPI/USART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| UART |
0 |
| USART |
1 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
182 |
| Minimum Operating Supply Voltage (V) |
2.4 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
10000 |
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ECAD MODELS
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