STM32F103CBT6TR STMicroelectronics IC MCU 32BIT 128KB FLASH 48LQFP

label:

2023/12/11 234

• Arm® 32-bit Cortex®-M3 CPU core
– 72 MHz maximum frequency, 1.25 DMIPS / MHz (Dhrystone 2.1) performance at 0 wait state memory access
– Single-cycle multiplication and hardware division

• Memories
– 64 or 128 Kbytes of Flash memory
– 20 Kbytes of SRAM

• Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage detector (PVD)
– 4 to 16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibratio

• Low-power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers

• 2x 12-bit, 1 µs A/D converters (up to 16 channels)
– Conversion range: 0 to 3.6 V
– Dual-sample and hold capability
– Temperature sensor

• DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs, I 2Cs and USARTs

• Up to 80 fast I/O ports
– 26/37/51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant

• Debug mode
– Serial wire debug (SWD) and JTAG interfaces

• Seven timers
– Three 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
– 16-bit, motor control PWM timer with dead-time generation and emergency stop
– Two watchdog timers (independent and window)
– SysTick timer 24-bit downcounter

• Up to nine communication interfaces
– Up to two I2C interfaces (SMBus/PMBus®)
– Up to three USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)
– Up to two SPIs (18 Mbit/s)
– CAN interface (2.0B Active)
– USB 2.0 full-speed interface

• CRC calculation unit, 96-bit unique ID

• Packages are ECOPACK®

CATALOG

STM32F103CBT6TR COUNTRY OF ORIGIN

STM32F103CBT6TR PARAMETRIC INFO

STM32F103CBT6TR PACKAGE INFO

STM32F103CBT6TR MANUFACTURING INFO

STM32F103CBT6TR PACKAGING INFO

STM32F103CBT6TR ECAD Models

COUNTRY OF ORIGIN

Malaysia

Philippines

Taiwan (Province of China)

China

PARAMETRIC INFO

Tradename	STM32
Family Name	STM32F
Data Bus Width (bit)	32
Device Core	ARM Cortex M3
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	72
Program Memory Type	Flash
Program Memory Size	128KB
RAM Size	20KB
Temperature Sensor	Yes
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Trace Hardware	JTAG/SWD
Maximum Dhrystone MIPS (MIPS)	1.25
DMA Channels	7
CAN Type	2.0B
Direct Memory Access	Yes
Floating Point Unit	No
Bluetooth	No
Wi-Fi	No
Multiply Accumulate	No
Input Capture Channels	4
Output Compare Channels	4
Internal/External Clock Type	Internal/External
Touch Sensing Interface	No
Power On Reset	No
Memory Protection Unit	No
Maximum CPU Frequency (MHz)	72
Number of Programmable I/Os	37
Number of Timers	4
ADC Channels	10/10
ADC Resolution (bit)	12/12
Core Architecture	ARM
Number of ADCs	Dual
PWM	1
Watchdog	2
Parallel Master Port	No
Real Time Clock	Yes
Special Features	CAN Controller
Interface Type	CAN/I2C/SPI/USART/USB
Programmability	Yes
SPI	2
I2C	2
I2S	0
UART	0
USART	3
CAN	1
USB	1
Ethernet	0
Maximum Power Dissipation (mW)	363
Minimum Operating Supply Voltage (V)	2
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	48
Lead Shape	Gull-wing
PCB	48
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	7
Package Width (mm)	7
Package Height (mm)	1.4
Package Diameter (mm)	N/R
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BBC
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years

PACKAGING INFO

Packaging	Tape and Reel
Quantity Of Packaging	10000

ECAD MODELS