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• Arm® 32-bit Cortex®-M3 CPU core \
– 72 MHz maximum frequency,
1.25 DMIPS / MHz (Dhrystone 2.1)
performance at 0 wait state memory
access
– Single-cycle multiplication and hardware
division |
• Memories
– 64 or 128 Kbytes of Flash memory
– 20 Kbytes of SRAM |
• Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage
detector (PVD)
– 4 to 16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration |
• Low-power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers |
• 2x 12-bit, 1 µs A/D converters (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Dual-sample and hold capability
– Temperature sensor |
• DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
I
2Cs and USARTs |
• Up to 80 fast I/O ports
– 26/37/51/80 I/Os, all mappable on 16
external interrupt vectors and almost all
5 V-tolerant |
• Debug mode
– Serial wire debug (SWD) and JTAG
interfaces |
• Seven timers
– Three 16-bit timers, each with up to
4 IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input
– 16-bit, motor control PWM timer with
dead-time generation and emergency stop
– Two watchdog timers (independent and
window)
– SysTick timer 24-bit downcounter |
• Up to nine communication interfaces
– Up to two I2C interfaces (SMBus/PMBus®)
– Up to three USARTs (ISO 7816 interface,
LIN, IrDA capability, modem control)
– Up to two SPIs (18 Mbit/s)
– CAN interface (2.0B Active)
– USB 2.0 full-speed interface |
| • CRC calculation unit, 96-bit unique ID |
| • Packages are ECOPACK® |
|
| CATALOG |
| STM32F103R8T6 COUNTRY OF ORIGIN |
| STM32F103R8T6 PARAMETRIC INFO |
| STM32F103R8T6 PACKAGE INFO |
| STM32F103R8T6 MANUFACTURING INFO |
| STM32F103R8T6 PACKAGING INFO |
| STM32F103R8T6 ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Morocco |
| Singapore |
| China |
| Malta |
| Philippines |
| Taiwan (Province of China) |
| Malaysia |
|
| PARAMETRIC INFO |
| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Family Name |
STM32F |
| Device Core |
ARM Cortex M3 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
72 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
20KB |
| Maximum CPU Frequency (MHz) |
72 |
| Trace Hardware |
JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
1.25 |
| DMA Channels |
7 |
| CAN Type |
2.0B |
| Direct Memory Access |
Yes |
| Floating Point Unit |
No |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Internal/External Clock Type |
Internal/External |
| Touch Sensing Interface |
No |
| Power On Reset |
No |
| Memory Protection Unit |
No |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Number of Programmable I/Os |
51 |
| Number of Timers |
4 |
| ADC Channels |
16/16 |
| ADC Resolution (bit) |
12/12 |
| Number of ADCs |
Dual |
| Core Architecture |
ARM |
| PWM |
1 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/SPI/USART/USB |
| Programmability |
Yes |
| SPI |
2 |
| I2C |
2 |
| I2S |
0 |
| UART |
0 |
| USART |
3 |
| CAN |
1 |
| USB |
1 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
444 |
| Minimum Operating Supply Voltage (V) |
2 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
10000 |
|
| |
| ECAD MODELS |
 |
| |
|
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