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• Core: Arm® 32-bit Cortex®-M3 CPU
– 72 MHz maximum frequency, 1.25 DMIPS/MHz
(Dhrystone 2.1) performance at 0 wait state
memory access
– Single-cycle multiplication and hardware
division
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• Memories
– 256 to 512 Kbytes of Flash memory
– up to 64 Kbytes of SRAM
– Flexible static memory controller with 4 Chip
Select. Supports Compact Flash, SRAM,
PSRAM, NOR and NAND memories
– LCD parallel interface, 8080/6800 modes
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• Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage detector
(PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC with calibration
– 32 kHz oscillator for RTC with calibration
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| • Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers |
| • 3 × 12-bit, 1 µs A/D converters (up to 21
channels)
– Conversion range: 0 to 3.6 V
– Triple-sample and hold capability
– Temperature sensor |
| • 2 × 12-bit D/A converters |
| • DMA: 12-channel DMA controller
– Supported peripherals: timers, ADCs, DAC,
SDIO, I2Ss, SPIs, I2Cs and USARTs
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| • Debug mode
– Serial wire debug (SWD) & JTAG interfaces
– Cortex®-M3 Embedded Trace Macrocell™
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| • Up to 112 fast I/O ports
– 51/80/112 I/Os, all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant |
| • Up to 11 timers
– Up to four 16-bit timers, each with up to 4
IC/OC/PWM or pulse counter and quadrature
(incremental) encoder input
– 2 × 16-bit motor control PWM timers with deadtime generation and emergency stop
– 2 × watchdog timers (Independent and Window)
– SysTick timer: a 24-bit downcounter
– 2 × 16-bit basic timers to drive the DAC
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| • Up to 13 communication interfaces
– Up to 2 × I2C interfaces (SMBus/PMBus)
– Up to 5 USARTs (ISO 7816 interface, LIN, IrDA
capability, modem control)
– Up to 3 SPIs (18 Mbit/s), 2 with I2S interface
multiplexed
– CAN interface (2.0B Active)
– USB 2.0 full speed interface
– SDIO interface
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| • CRC calculation unit, 96-bit unique ID |
| • ECOPACK® packages |
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| CATALOG |
| STM32F103RCT6 COUNTRY OF ORIGIN |
STM32F103RCT6 PARAMETRIC INFO
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STM32F103RCT6 PACKAGE INFO
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STM32F103RCT6 MANUFACTURING INFO
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STM32F103RCT6 PACKAGING INFO
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STM32F103RCT6 ECAD MODELS
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| COUNTRY OF ORIGIN |
| China |
| Morocco |
| Taiwan (Province of China) |
| Malaysia |
| Malta |
| Singapore |
| Philippines |
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PARAMETRIC INFO
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| Data Bus Width (bit) |
32 |
| Family Name |
STM32F |
| Device Core |
ARM Cortex M3 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
72 |
| Program Memory Type |
Flash |
| Program Memory Size |
256KB |
| RAM Size |
64KB |
| Maximum CPU Frequency (MHz) |
72 |
| Number of Programmable I/Os |
51 |
| Number of Timers |
8 |
| ADC Channels |
16/16/16 |
| DAC Channels |
2/2 |
| ADC Resolution (bit) |
12/12/12 |
| Number of ADCs |
Triple |
| Core Architecture |
ARM |
| Number of DACs |
Dual |
| DAC Resolution (bit) |
12/12 |
| PWM |
2 |
| Watchdog |
2 |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/I2S/SPI/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
2 |
| I2S |
2 |
| Process Technology |
CMOS |
| UART |
0 |
| USART |
5 |
| CAN |
1 |
| USB |
1 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
444 |
| Minimum Operating Supply Voltage (V) |
2 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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ECAD MODELS
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