STM32F103RCY6TR STMicroelectronics IC MCU 32BIT 256KB FLASH 64WLCSP

label:
2025/06/11 17
STM32F103RCY6TR STMicroelectronics  IC MCU 32BIT 256KB FLASH 64WLCSP


CATALOG
STM32F103RCY6TR COUNTRY OF ORIGIN
STM32F103RCY6TR PARAMETRIC INFO
STM32F103RCY6TR PACKAGE INFO
STM32F103RCY6TR MANUFACTURING INFO
STM32F103RCY6TR PACKAGING INFO
STM32F103RCY6TR ECAD MODELS


COUNTRY OF ORIGIN
Singapore


PARAMETRIC INFO
Tradename STM32
Family Name STM32F
Data Bus Width (bit) 32
Device Core ARM Cortex M3
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 72
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 48KB
Maximum CPU Frequency (MHz) 72
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Input Capture Channels 4
Output Compare Channels 4
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset Yes
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Trace Hardware JTAG/SWD
Maximum Dhrystone MIPS (MIPS) 1.25
DMA Channels 12
CAN Type 2.0B
GPIO 51
Number of Timers 8
ADC Channels 16/16/16
DAC Channels 2/2
ADC Resolution (bit) 12/12/12
Core Architecture ARM
Number of ADCs 3
LIN 0
Number of Cores 1
Number of DACs 2
DAC Resolution (bit) 12/12
PWM 2
Watchdog 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/I2C/I2S/SPI/USART/USB
Programmability Yes
SPI 3
I2C 2
I2S 2
Process Technology CMOS
UART 0
USART 5
CAN 1
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 400
Minimum Operating Supply Voltage (V) 2
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package WLCSP
Basic Package Type Ball Grid Array
Pin Count 64
Lead Shape Ball
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 4.47
Package Width (mm) 4.4
Package Height (mm) 0.36
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.59
Mounting Surface Mount
Package Material Plastic
Package Description Wafer Level Chip Scale Package
Package Family Name CSP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 10000


ECAD MODELS


Продукт RFQ