STM32F103TBU6 STMicroelectronics IC MCU 32BIT 128KB FLASH 36QFPN

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2025/02/14 95
STM32F103TBU6 STMicroelectronics IC MCU 32BIT 128KB FLASH 36QFPN


CATALOG
STM32F103TBU6 COUNTRY OF ORIGIN
STM32F103TBU6 PARAMETRIC INFO
STM32F103TBU6 PACKAGE INFO
STM32F103TBU6 MANUFACTURING INFO
STM32F103TBU6 PACKAGING INFO


COUNTRY OF ORIGIN
China
Malaysia
Philippines


PARAMETRIC INFO
Tradename STM32
Family Name STM32F
Data Bus Width (bit) 32
Device Core ARM Cortex M3
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 72
Program Memory Type Flash
Program Memory Size 128KB
RAM Size 20KB
Input Capture Channels 4
Output Compare Channels 4
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Trace Hardware JTAG/SWD
Maximum Dhrystone MIPS (MIPS) 1.25
DMA Channels 7
CAN Type 2.0B
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Maximum CPU Frequency (MHz) 72
Number of Programmable I/Os 26
Number of Timers 4
ADC Channels 10/10
ADC Resolution (bit) 12/12
Core Architecture ARM
Number of ADCs 2
PWM 1
Watchdog 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/I2C/SPI/USART/USB
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 0
USART 2
CAN 1
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 2
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package VFQFPN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 36
Lead Shape No Lead
PCB 36
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 6
Package Width (mm) 6
Package Height (mm) 0.88
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Material Plastic
Package Description Very Fine Quad Flat Package No Lead, Exposed Pad
Package Family Name QFP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material Ag
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray

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