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• Low power– Sleep, Stop and Standby modes– VBAT supply for RTC and backup registers
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• 3 × 12-bit, 1 µs A/D converters (up to 21 channels)– Conversion range: 0 to 3.6 V– Triple-sample and hold capability– Temperature sensor
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• 2 × 12-bit D/A converters
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• DMA: 12-channel DMA controller– Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
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• Debug mode– Serial wire debug (SWD) & JTAG interfaces– Cortex®-M3 Embedded Trace Macrocell™
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| CATALOG |
STM32F103ZET6TR COUNTRY OF ORIGIN
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STM32F103ZET6TR PARAMETRIC INFO
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STM32F103ZET6TR PACKAGE INFO
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STM32F103ZET6TR MANUFACTURING INFO
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STM32F103ZET6TR PACKAGING INFO
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| STM32F103ZET6TR ECAD MODELS |
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COUNTRY OF ORIGIN
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Philippines
|
Korea (Republic of)
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Taiwan (Province of China)
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PARAMETRIC INFO
|
| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M3 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
72 |
| Program Memory Type |
Flash |
| Program Memory Size |
512KB |
| RAM Size |
64KB |
| Maximum CPU Frequency (MHz) |
72 |
| Number of Programmable I/Os |
112 |
| Number of Timers |
8 |
| ADC Channels |
21/21/21 |
| DAC Channels |
2/2 |
| ADC Resolution (bit) |
12/12/12 |
| Core Architecture |
ARM |
| Number of ADCs |
Triple |
| Number of DACs |
Dual |
| DAC Resolution (bit) |
12/12 |
| PWM |
2 |
| Watchdog |
2 |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/SPI/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
2 |
| I2S |
0 |
| UART |
0 |
| USART |
5 |
| CAN |
1 |
| USB |
1 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
666 |
| Minimum Operating Supply Voltage (V) |
2 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
144 |
| Lead Shape |
Gull-wing |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
20 |
| Package Width (mm) |
20 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
22 |
| Package Overall Width (mm) |
22 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BFB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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