STM32F107RCT6 STMicroelectronics IC MCU 32BIT 256KB FLASH 64LQFP

label:

2023/11/1 191

• Core: ARM® 32-bit Cortex®-M3 CPU
– 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
– Single-cycle multiplication and hardware division

• Memories
– 64 to 256 Kbytes of Flash memory
– 64 Kbytes of general-purpose SRAM

• Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage detector (PVD)
– 3-to-25 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC with calibration
– 32 kHz oscillator for RTC with calibration

• Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers

2 × 12-bit, 1 µs A/D converters (16 channels)
– Conversion range: 0 to 3.6 V
– Sample and hold capability
– Temperature sensor
– up to 2 MSPS in interleaved mode

• 2 × 12-bit D/A converters

• DMA: 12-channel DMA controller
– Supported peripherals: timers, ADCs, DAC, I2Ss, SPIs, I2Cs and USARTs

• Debug mode
– Serial wire debug (SWD) & JTAG interfaces
– Cortex®-M3 Embedded Trace Macrocell™

• Up to 80 fast I/O ports
– 51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant

• CRC calculation unit, 96-bit unique ID

• Up to 10 timers with pinout remap capability
– Up to four 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
– 1 × 16-bit motor control PWM timer with dead-time generation and emergency stop
– 2 × watchdog timers (Independent and Window)
– SysTick timer: a 24-bit downcounter
– 2 × 16-bit basic timers to drive the DAC

• Up to 14 communication interfaces with pinout remap capability
– Up to 2 × I2C interfaces (SMBus/PMBus)
– Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)
– Up to 3 SPIs (18 Mbit/s), 2 with a multiplexed I2S interface that offers audio class accuracy via advanced PLL schemes
– 2 × CAN interfaces (2.0B Active) with 512 bytes of dedicated SRAM
– USB 2.0 full-speed device/host/OTG controller with on-chip PHY that supports HNP/SRP/ID with 1.25 Kbytes of dedicated SRAM
– 10/100 Ethernet MAC with dedicated DMA and SRAM (4 Kbytes): IEEE1588 hardware support, MII/RMII available on all packages

CATALOG

STM32F107RCT6 Country of Origin

STM32F107RCT6 Parametric Info

STM32F107RCT6 Package Info

STM32F107RCT6 Manufacturing Info

STM32F107RCT6 Packaging Info

STM32F107RCT6 ECAD Models

COUNTRY OF ORIGIN

China

Malaysia

Philippines

Taiwan (Province of China)

PARAMETRIC INFO

Data Bus Width (bit)	32
Family Name	STM32F
Device Core	ARM Cortex M3
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	72
Program Memory Type	Flash
Program Memory Size	256KB
RAM Size	64KB
Maximum CPU Frequency (MHz)	72
Number of Programmable I/Os	51
Number of Timers	7
ADC Channels	16/16
ADC Resolution (bit)	12/12
DAC Channels	2/2
Core Architecture	ARM
Number of ADCs	Dual
DAC Resolution (bit)	12/12
Number of DACs	Dual
PWM	1
Watchdog	2
Special Features	CAN Controller
Interface Type	CAN/Ethernet/I2C/I2S/SPI/USART/USB
Programmability	Yes
SPI	3
I2C	1
I2S	2
UART	0
USART	5
CAN	2
USB	1
Ethernet	1
Maximum Power Dissipation (mW)	444
Minimum Operating Supply Voltage (V)	2
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	64
Lead Shape	Gull-wing
PCB	64
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	10
Package Width (mm)	10
Package Height (mm)	1.4
Package Diameter (mm)	N/R
Package Overall Length (mm)	12
Package Overall Width (mm)	12
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BCD
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	IPC-1752
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years

PACKAGING INFO

Packaging

Tray

ECAD MODELS