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• Memories– Up to 1 Mbyte of Flash memory– 512 bytes of OTP memory– Up to 128 + 4 Kbytes of SRAM– Flexible static memory controller that
supports Compact Flash, SRAM, PSRAM,NOR and NAND memories– LCD parallel interface, 8080/6800 modes
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• Clock, reset and supply management– From 1.8 to 3.6 V application supply + I/Os– POR, PDR, PVD and BOR– 4 to 26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC– 32 kHz oscillator for RTC with calibration– Internal 32 kHz RC with calibration
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• Low-power modes– Sleep, Stop and Standby modes– VBAT supply for RTC, 20 × 32 bit backupregisters, and optional 4 Kbytes backup
SRAM
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| • 3 × 12-bit, 0.5 µs ADCs with up to 24 channels and up to 6 MSPS in triple interleaved mode |
| • 2 × 12-bit D/A converters |
| • General-purpose DMA: 16-stream controller with centralized FIFOs and burst support |
| |
| CATALOG |
| STM32F205RBT6 COUNTRY OF ORIGIN |
STM32F205RBT6 PARAMETRIC INFO
|
STM32F205RBT6 PACKAGE INFO
|
STM32F205RBT6 MANUFACTURING INFO
|
STM32F205RBT6 PACKAGING INFO
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STM32F205RBT6 EACD MODELS
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| COUNTRY OF ORIGIN |
| Philippines |
| Malaysia |
| China |
Taiwan (Province of China)
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|
PARAMETRIC INFO
|
| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M3 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
120 |
| Program Memory Type |
Flash |
| Program Memory Size |
128KB |
| RAM Size |
68KB |
| Maximum CPU Frequency (MHz) |
120 |
| Hardware Acceleration |
ART |
| Trace Hardware |
ETM/JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
150 |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| Direct Memory Access |
Yes |
| Floating Point Unit |
No |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Touch Sensing Interface |
Yes |
| Power On Reset |
Yes |
| Memory Protection Unit |
Yes |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Number of Programmable I/Os |
51 |
| Number of Timers |
14 |
| ADC Channels |
16/16/16 |
| DAC Channels |
2/2 |
| ADC Resolution (bit) |
12/12/12 |
| Core Architecture |
ARM |
| Number of ADCs |
Triple |
| Number of DACs |
Dual |
| DAC Resolution (bit) |
12/12 |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
3 |
| I2S |
2 |
| UART |
2 |
| USART |
4 |
| CAN |
2 |
| USB |
2 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
444 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
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