STM32F207VET6 STMicroelectronics IC MCU 32BIT 512KB FLASH 100LQFP

label:
2025/02/19 84
STM32F207VET6 STMicroelectronics 	IC MCU 32BIT 512KB FLASH 100LQFP


CATALOG
STM32F207VET6 COUNTRY OF ORIGIN
STM32F207VET6 PARAMETRIC INFO
STM32F207VET6 PACKAGE INFO
STM32F207VET6 MANUFACTURING INFO
STM32F207VET6 PACKAGING INFO
STM32F207VET6 ECAD MODELS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Family Name STM32F
Data Bus Width (bit) 32
Device Core ARM Cortex M3
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 120
Program Memory Type Flash
Program Memory Size 512KB
RAM Size 132KB
Input Capture Channels 4
Output Compare Channels 4
Touch Sensing Interface Yes
Power On Reset Yes
Memory Protection Unit Yes
Temperature Sensor Yes
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Hardware Acceleration ART
Trace Hardware ETM/JTAG/SWD
Maximum Dhrystone MIPS (MIPS) 150
DMA Channels 16
CAN Type 2.0B
Direct Memory Access Yes
Floating Point Unit No
Wi-Fi No
Multiply Accumulate No
Maximum CPU Frequency (MHz) 120
Number of Programmable I/Os 82
Number of Timers 14
ADC Channels 16/16/16
ADC Resolution (bit) 12/12/12
DAC Channels 2/2
Core Architecture ARM
Number of ADCs 3
DAC Resolution (bit) 12/12
Number of DACs 2
PWM 2
Watchdog 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 3
I2C 3
I2S 2
UART 2
USART 4
CAN 2
USB 2
Ethernet 1
Maximum Power Dissipation (mW) 434
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BED
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ