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• Core: Arm® Cortex®-M4 32-bit CPU with FPU(72 MHz max), single-cycle multiplication and HW division, 90 DMIPS (from CCM), DSP instruction and MPU (memory protection unit)
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• Operating conditions:– VDD, VDDA voltage range: 2.0 V to 3.6 V
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• Memories– 128 to 256 Kbytes of Flash memory– Up to 40 Kbytes of SRAM, with HW parity check implemented on the first 16 Kbytes.– Routine booster: 8 Kbytes of SRAM on instruction and data bus, with HW parity check (CCM)
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• CRC calculation unit |
• Reset and supply management– Power-on/power-down reset (POR/PDR)– Programmable voltage detector (PVD)– Low-power modes: Sleep, Stop and
Standby– VBAT supply for RTC and backup registers |
• Clock management– 4 to 32 MHz crystal oscillator– 32 kHz oscillator for RTC with calibration– Internal 8 MHz RC with x 16 PLL option–Internal 40 kHz oscillator |
• Up to 87 fast I/Os– All mappable on external interrupt vectors– Several 5 V-tolerant |
• Interconnect matrix |
• 12-channel DMA controller |
• Four ADCs 0.20 µS (up to 39 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, single ended/differential input, separate analog supply from 2 to 3.6 V |
• Two 12-bit DAC channels with analog supply from 2.4 to 3.6 V |
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CATALOG |
STM32F303CCT6 COUNTRY OF ORIGIN |
STM32F303CCT6 PARAMETRIC INFO
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STM32F303CCT6 PACKAGE INFO
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STM32F303CCT6 MANUFACTURING INFO
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STM32F303CCT6 PACKAGING INFO
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STM32F303CCT6 EACD MODELS
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COUNTRY OF ORIGIN |
China |
Philippines |
Taiwan (Province of China) |
Malaysia |
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PARAMETRIC INFO
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Family Name |
STM32F |
Data Bus Width (bit) |
32 |
Device Core |
ARM Cortex M4 |
Instruction Set Architecture |
RISC |
Maximum Clock Rate (MHz) |
72 |
Program Memory Type |
Flash |
Program Memory Size |
256KB |
RAM Size |
40KB |
Maximum CPU Frequency (MHz) |
72 |
Number of Programmable I/Os |
37 |
Number of Timers |
10 |
ADC Channels |
12/12/12/12 |
DAC Channels |
12/12 |
ADC Resolution (bit) |
12/12/12/12 |
Core Architecture |
ARM |
Number of ADCs |
Quad |
Number of DACs |
Dual |
DAC Resolution (bit) |
12/12 |
Watchdog |
2 |
Analog Comparators |
7 |
Special Features |
CAN Controller |
Interface Type |
CAN/I2C/I2S/SPI/UART/USART/USB |
Programmability |
Yes |
SPI |
3 |
I2C |
2 |
I2S |
3 |
UART |
2 |
USART |
3 |
CAN |
1 |
USB |
1 |
Ethernet |
0 |
Maximum Power Dissipation (mW) |
488 |
Minimum Operating Supply Voltage (V) |
2 |
Typical Operating Supply Voltage (V) |
2.5|3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Industrial |
Operating Supply Voltage (V) |
2.5|3.3 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
48 |
Lead Shape |
Gull-wing |
PCB |
48 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
7 |
Package Width (mm) |
7 |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BBC |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
10000 |
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ECAD MODELS
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