STM32F303VDT6 STMicroelectronics IC MCU 32BIT 384KB FLASH 100LQFP

label:
2025/02/11 82
STM32F303VDT6 STMicroelectronics 	IC MCU 32BIT 384KB FLASH 100LQFP


CATALOG
STM32F303VDT6 COUNTRY OF ORIGIN
STM32F303VDT6 PARAMETRIC INFO
STM32F303VDT6 PACKAGE INFO
STM32F303VDT6 MANUFACTURING INFO
STM32F303VDT6 PACKAGING INFO
STM32F303VDT6 ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Malaysia


PARAMETRIC INFO
Family Name STM32F
Data Bus Width (bit) 32
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 72
Program Memory Type Flash
Program Memory Size 384KB
RAM Size 64KB
Maximum CPU Frequency (MHz) 72
Number of Programmable I/Os 37
Number of Timers 11
ADC Channels 39/39/39/39
ADC Resolution (bit) 12/12/12/12
DAC Channels 2
Core Architecture ARM
Number of ADCs 4
DAC Resolution (bit) 12
Number of DACs 1
Interface Type CAN/I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 4
I2C 3
I2S 2
UART 2
USART 3
CAN 1
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 476
Minimum Operating Supply Voltage (V) 2
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BED
Package Outline Link to Datasheet


MANUFACTURING INFO
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray


ECAD MODELS


Продукт RFQ