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• LCD parallel interface, 8080/6800 modes
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• 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode
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• 2×12-bit D/A converters
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• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
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• Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature(incremental) encoder input
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| CATALOG |
STM32F405OGY6TR COUNTRY OF ORIGIN
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STM32F405OGY6TR PARAMETRIC INFO
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STM32F405OGY6TR PACKAGE INFO
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STM32F405OGY6TR MANUFACTURING INFO
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STM32F405OGY6TR PACKAGING INFO
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STM32F405OGY6TR ECAD MODELS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Tradename |
STM32 |
| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
168 |
| Program Memory Type |
Flash |
| Program Memory Size |
1MB |
| RAM Size |
196KB |
| Maximum CPU Frequency (MHz) |
168 |
| EEPROM |
4KB |
| Direct Memory Access |
Yes |
| Floating Point Unit |
Yes |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
16 |
| Output Compare Channels |
16 |
| Internal/External Clock Type |
External |
| Touch Sensing Interface |
No |
| Power On Reset |
Yes |
| Memory Protection Unit |
Yes |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Hardware Acceleration |
FPU |
| Trace Hardware |
JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
210 |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| GPIO |
72 |
| Number of Timers |
14 |
| ADC Channels |
13/13/13 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
12/12/12 |
| Core Architecture |
ARM |
| Number of ADCs |
3 |
| Number of DACs |
1 |
| DAC Resolution (bit) |
12 |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
3 |
| I2S |
2 |
| UART |
2 |
| USART |
4 |
| CAN |
2 |
| USB |
2 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
543 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
WLCSP |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
90 |
| Lead Shape |
Ball |
| PCB |
90 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.4 |
| Package Length (mm) |
4.22 |
| Package Width (mm) |
3.97 |
| Package Height (mm) |
0.38 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.57 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Wafer Level Chip Scale Package |
| Package Family Name |
CSP |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCuNi |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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