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• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution
from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
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• LCD parallel interface, 8080/6800 modes
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• Low-power operation– Sleep, Stop and Standby modes– VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM
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| • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode
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| • 2×12-bit D/A converters |
| • Very Low Dropout Voltage |
| • Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature(incremental) encoder input |
| • Debug mode– Serial wire debug (SWD) & JTAG interfaces– Cortex-M4 Embedded Trace Macrocell™ |
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| CATALOG |
| STM32F407IGT6 COUNTRY OF ORIGIN |
STM32F407IGT6 PARAMETRIC INFO
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STM32F407IGT6 PACKAGE INFO
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STM32F407IGT6 MANUFACTURING INFO
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STM32F407IGT6 PACKAGING INFO
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STM32F407IGT6 EACD MODELS
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Series name |
STM32F |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
168 |
| Program Memory Type |
Flash |
| Program Memory Size |
1MB |
| RAM Size |
196KB |
| Maximum CPU Frequency (MHz) |
168 |
| Hardware Acceleration |
FPU |
| Trace Hardware |
JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
210 |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| EEPROM |
4KB |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Direct Memory Access |
yes |
| Floating Point Unit |
yes |
| Bluetooth |
no |
| Wi-Fi |
no |
| Multiply Accumulate |
no |
| Input Capture Channels |
16 |
| Output Compare Channels |
16 |
| Internal/External Clock Type |
External |
| Touch Sensing Interface |
no |
| Power On Reset |
yes |
| Memory Protection Unit |
yes |
| Temperature Sensor |
yes |
| DDR |
no |
| Memory Management Unit |
no |
| Integrated Development Environment |
no |
| Super Scalar |
no |
| External Bus Interface |
no |
| Number of Programmable I/Os |
140 |
| Number of Timers |
14 |
| ADC Channels |
24/24/24 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
12/12/12 |
| Number of ADCs |
Triple |
| Core Architecture |
ARM |
| Number of DACs |
Single |
| DAC Resolution (bit) |
12 |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
no |
| Real Time Clock |
yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
yes |
| SPI |
3 |
| I2C |
3 |
| I2S |
2 |
| Process Technology |
CMOS |
| UART |
2 |
| USART |
4 |
| CAN |
2 |
| USB |
2 |
| Ethernet |
1 |
| Maximum Power Dissipation (mW) |
526 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Rating |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier packaging |
LQFP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
176 |
| Pin shape |
Gull-wing |
| PCB |
176 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
24.1(Max) |
| Package width (mm) |
24.1(Max) |
| Package height (mm) |
1.45(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
26.1(Max) |
| Package Overall Width (mm) |
26.1(Max) |
| Package Overall Height (mm) |
1.6(Max) |
| Mounting surface height (mm) |
1.6(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Low Profile Quad Flat Package |
| Package series name |
QFP |
| JEDEC |
not applicable |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Package |
Tray |
| Packing quantity |
10000 |
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ECAD MODELS
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