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• Memories– Up to 1 Mbyte of Flash memory– Up to 192+4 Kbytes of SRAM including 64-Kbyte of CCM (core coupled memory) dataRAM– 512 bytes of OTP memory– Flexible static memory controllersupporting Compact Flash, SRAM,PSRAM, NOR and NAND memories
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• LCD parallel interface, 8080/6800 modes
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• Clock, reset and supply management– 1.8 V to 3.6 V application supply and I/Os– POR, PDR, PVD and BOR– 4-to-26 MHz crystal oscillator– Internal 16 MHz factory-trimmed RC (1%accuracy)– 32 kHz oscillator for RTC with calibration– Internal 32 kHz RC with calibration
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| • Low-power operation– Sleep, Stop and Standby modes– VBAT supply for RTC, 20×32 bit backupregisters + optional 4 KB backup SRAM
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| • 3×12-bit, 2.4 MSPS A/D converters: up to 24channels and 7.2 MSPS in triple interleavedmode |
| • 2×12-bit D/A converters |
| • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support |
• Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 168 MHz, each with up to 4IC/OC/PWM or pulse counter and quadrature
(incremental) encoder input |
| • Debug mode– Serial wire debug (SWD) & JTAGinterfaces– Cortex-M4 Embedded Trace Macrocell™ |
| • Up to 140 I/O ports with interrupt capability– Up to 136 fast I/Os up to 84 MHz– Up to 138 5 V-tolerant I/Os |
• Up to 15 communication interfaces– Up to 3 × I2C interfaces (SMBus/PMBus)– Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)– Up to 3 SPIs (42 Mbits/s), 2 with muxedfull-duplex I2S to achieve audio classaccuracy via internal audio PLL or external
clock– 2 × CAN interfaces (2.0B Active)– SDIO interface |
| • Advanced connectivity– USB 2.0 full-speed device/host/OTGcontroller with on-chip PHY– USB 2.0 high-speed/full-speeddevice/host/OTG controller with dedicatedDMA, on-chip full-speed PHY and ULPI– 10/100 Ethernet MAC with dedicated DMA:supports IEEE 1588v2 hardware, MII/RMII |
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| CATALOG |
| STM32F407VGT6 COUNTRY OF ORIGIN |
STM32F407VGT6 PARAMETRIC INFO
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STM32F407VGT6 PACKAGE INFO
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STM32F407VGT6 MANUFACTURING INFO
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STM32F407VGT6 PACKAGING INFO
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STM32F407VGT6 EACD MODELS
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| COUNTRY OF ORIGIN |
| Korea (Republic of) |
| Taiwan (Province of China) |
| Philippines |
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PARAMETRIC INFO
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| Tradename |
STM32 |
| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
168 |
| Program Memory Type |
Flash |
| Program Memory Size |
1MB |
| RAM Size |
196KB |
| Maximum CPU Frequency (MHz) |
168 |
| Hardware Acceleration |
FPU |
| Trace Hardware |
JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
210 |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| EEPROM |
4KB |
| Direct Memory Access |
Yes |
| Floating Point Unit |
Yes |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
16 |
| Output Compare Channels |
16 |
| Internal/External Clock Type |
External |
| Touch Sensing Interface |
No |
| Power On Reset |
Yes |
| Memory Protection Unit |
Yes |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Number of Programmable I/Os |
82 |
| Number of Timers |
14 |
| ADC Channels |
16/16/16 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
12/12/12 |
| Core Architecture |
ARM |
| Number of ADCs |
Triple |
| Number of DACs |
Single |
| DAC Resolution (bit) |
12 |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
3 |
| I2S |
2 |
| Process Technology |
CMOS |
| UART |
2 |
| USART |
4 |
| CAN |
2 |
| USB |
2 |
| Ethernet |
1 |
| Maximum Power Dissipation (mW) |
465 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
100 |
| Lead Shape |
Gull-wing |
| PCB |
100 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
14 |
| Package Width (mm) |
14 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
16 |
| Package Overall Width (mm) |
16 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BED |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
10000 |
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ECAD MODELS
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