 |
|
| • Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator) allowing 0-wait state execution
from Flash memory, frequency up to 168 MHz,
memory protection unit, 210 DMIPS/
1.25 DMIPS/MHz (Dhrystone 2.1), and DSP
instructions |
• Memories
– Up to 1 Mbyte of Flash memory
– Up to 192+4 Kbytes of SRAM including 64-
Kbyte of CCM (core coupled memory) data
RAM
– 512 bytes of OTP memory
– Flexible static memory controller
supporting Compact Flash, SRAM,
PSRAM, NOR and NAND memories |
| • LCD parallel interface, 8080/6800 modes |
• Clock, reset and supply management
– 1.8 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1%
accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration |
• Low-power operation
– Sleep, Stop and Standby modes
– VBAT supply for RTC, 20×32 bit backup
registers + optional 4 KB backup SRAM
|
| • 3×12-bit, 2.4 MSPS A/D converters: up to 24
channels and 7.2 MSPS in triple interleaved
mode |
| • 2×12-bit D/A converters |
| • General-purpose DMA: 16-stream DMA
controller with FIFOs and burst support
|
| • 8- to 14-bit parallel camera interface up to
54 Mbytes/s |
| • True random number generator |
| • CRC calculation unit |
| • 96-bit unique ID |
| • RTC: subsecond accuracy, hardware calendar |
|
| CATALOG |
| STM32F407ZGT6 COUNTRY OF ORIGIN |
| STM32F407ZGT6 PARAMETRIC INFO |
| STM32F407ZGT6 PACKAGE INFO |
| STM32F407ZGT6 MANUFACTURING INFO |
| STM32F407ZGT6 PACKAGING INFO |
| STM32F407ZGT6 ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Family Name |
STM32F |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
168 |
| Program Memory Type |
Flash |
| Program Memory Size |
1MB |
| RAM Size |
196KB |
| Hardware Acceleration |
FPU |
| Trace Hardware |
JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
210 |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| EEPROM |
4KB |
| Direct Memory Access |
Yes |
| Floating Point Unit |
Yes |
| Bluetooth |
No |
| Wi-Fi |
No |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Multiply Accumulate |
No |
| Input Capture Channels |
16 |
| Output Compare Channels |
16 |
| Internal/External Clock Type |
External |
| Touch Sensing Interface |
No |
| Power On Reset |
Yes |
| Memory Protection Unit |
Yes |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Maximum CPU Frequency (MHz) |
168 |
| Number of Programmable I/Os |
114 |
| Number of Timers |
14 |
| ADC Channels |
24/24/24 |
| ADC Resolution (bit) |
12/12/12 |
| DAC Channels |
2 |
| Core Architecture |
ARM |
| Number of ADCs |
Triple |
| DAC Resolution (bit) |
12 |
| Number of DACs |
Single |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
3 |
| Process Technology |
CMOS |
| I2S |
2 |
| UART |
2 |
| USART |
4 |
| CAN |
2 |
| USB |
2 |
| Ethernet |
1 |
| Maximum Power Dissipation (mW) |
500 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
144 |
| Lead Shape |
Gull-wing |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
20 |
| Package Width (mm) |
20 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
22 |
| Package Overall Width (mm) |
22 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BFB |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
10000 |
|
| |
| ECAD MODELS |
 |
|
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