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• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
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• Memories– Up to 1 Mbyte of Flash memory– 256 Kbyte of SRAM– Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM,
NOR Flash memory– Dual mode Quad-SPI interface
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• LCD parallel interface, 8080/6800 modes
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• 1×12-bit, 2.4 MSPS ADC: up to 16 channels
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• 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support
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• General-purpose DMA: 16-stream DMA
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| CATALOG |
STM32F412VET6 COUNTRY OF ORIGIN
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STM32F412VET6 PARAMETRIC INFO
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STM32F412VET6 PACKAGE INFO
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STM32F412VET6 MANUFACTURING INFO
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STM32F412VET6 PACKAGING INFO
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STM32F412VET6 ECAD MODELS
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COUNTRY OF ORIGIN
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Philippines
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Malaysia
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PARAMETRIC INFO
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| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
100 |
| Program Memory Type |
Flash |
| Program Memory Size |
512KB |
| RAM Size |
256KB |
| Maximum CPU Frequency (MHz) |
100 |
| GPIO |
81 |
| Number of Timers |
14 |
| ADC Channels |
16 |
| ADC Resolution (bit) |
12 |
| Core Architecture |
ARM |
| Number of ADCs |
1 |
| PWM |
4 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/I2S/SPI/USART/USB |
| Programmability |
Yes |
| SPI |
5 |
| I2C |
3 |
| I2S |
5 |
| UART |
0 |
| USART |
4 |
| CAN |
2 |
| USB |
1 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
465 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
100 |
| Lead Shape |
Gull-wing |
| PCB |
100 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
14 |
| Package Width (mm) |
14 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
16 |
| Package Overall Width (mm) |
16 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BED |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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ECAD MODELS
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