STM32F413VHT6 STMicroelectronics IC MCU 32BIT 1.5MB FLASH 100LQFP

label:
2025/02/11 85
STM32F413VHT6 STMicroelectronics 	IC MCU 32BIT 1.5MB FLASH 100LQFP


CATALOG
STM32F413VHT6 COUNTRY OF ORIGIN
STM32F413VHT6 PARAMETRIC INFO
STM32F413VHT6 PACKAGE INFO
STM32F413VHT6 MANUFACTURING INFO
STM32F413VHT6 PACKAGING INFO
STM32F413VHT6 ECAD MODELS


COUNTRY OF ORIGIN
Korea (Republic of)
Taiwan (Province of China)
Malaysia
Philippines


PARAMETRIC INFO
Family Name STM32F
Data Bus Width (bit) 32
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 100
Program Memory Type Flash
Program Memory Size 1.5MB
RAM Size 320KB
Maximum CPU Frequency (MHz) 100
Number of Programmable I/Os 81
Number of Timers 15
ADC Channels 16
ADC Resolution (bit) 12
DAC Channels 2
Core Architecture ARM
Number of ADCs 1
DAC Resolution (bit) 12
Number of DACs 1
PWM 2
Watchdog 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 5
I2C 4
I2S 5
UART 3
USART 4
CAN 3
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 465
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BED
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray


ECAD MODELS


Продукт RFQ