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• Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait state execution
from Flash memory, frequency up to 180 MHz,
MPU, 225 DMIPS/1.25 DMIPS/MHz
(Dhrystone 2.1), and DSP instructions
|
• Memories
– Up to 2 MB of Flash memory organized into
two banks allowing read-while-write
– Up to 256+4 KB of SRAM including 64-KB
of CCM (core coupled memory) data RAM
– Flexible external memory controller with up
to 32-bit data bus: SRAM, PSRAM,
SDRAM/LPSDR SDRAM, Compact
Flash/NOR/NAND memories
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• LCD parallel interface, 8080/6800 modes
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| • LCD-TFT controller with fully programmable
resolution (total width up to 4096 pixels, total
height up to 2048 lines and pixel clock up to
83 MHz)
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| • Chrom-ART Accelerator™ for enhanced
graphic content creation (DMA2D) |
| • Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1%
accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration |
| • Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC, 20×32 bit backup
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| • 3×12-bit, 2.4 MSPS ADC: up to 24 channels
and 7.2 MSPS in triple interleaved mode
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| • 2×12-bit D/A converters |
|
| CATALOG |
| STM32F429ZIT6 COUNTRY OF ORIGIN |
STM32F429ZIT6 PARAMETRIC INFO
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STM32F429ZIT6 PACKAGE INFO
|
STM32F429ZIT6 MANUFACTURING INFO
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STM32F429ZIT6 PACKAGING INFO
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STM32F429ZIT6 ECAD MODELS
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| COUNTRY OF ORIGIN |
| France |
| Taiwan (Province of China) |
| Philippines |
|
PARAMETRIC INFO
|
| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Family Name |
STM32F |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
180 |
| Program Memory Type |
Flash |
| Program Memory Size |
2MB |
| RAM Size |
260KB |
| Maximum CPU Frequency (MHz) |
180 |
| Hardware Acceleration |
FPU |
| Trace Hardware |
JTAG/SWD |
| Maximum Dhrystone MIPS (MIPS) |
1.25 |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Direct Memory Access |
Yes |
| Floating Point Unit |
Yes |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Internal/External Clock Type |
Internal/External |
| Touch Sensing Interface |
No |
| Power On Reset |
No |
| Memory Protection Unit |
Yes |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Number of Programmable I/Os |
114 |
| Number of Timers |
14 |
| ADC Channels |
24/24/24 |
| DAC Channels |
2/2 |
| ADC Resolution (bit) |
12/12/12 |
| Number of ADCs |
Triple |
| Core Architecture |
ARM |
| Number of DACs |
Dual |
| DAC Resolution (bit) |
12/12 |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB |
| Timers Resolution (bit) |
16/32 |
| Programmability |
Yes |
| SPI |
6 |
| I2C |
3 |
| I2S |
2 |
| UART |
4 |
| USART |
4 |
| CAN |
2 |
| USB |
2 |
| Ethernet |
1 |
| Maximum Power Dissipation (mW) |
500 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
144 |
| Lead Shape |
Gull-wing |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
20 |
| Package Width (mm) |
20 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
22 |
| Package Overall Width (mm) |
22 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BFB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
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PACKAGING INFO
|
| Packaging |
Tray |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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