STM32F437IIH6TR STMicroelectronics IC MCU 32BIT 2MB FLASH 176UFBGA

label:

2023/11/16 226

• Includes ST state-of-the-art patented technology.

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ARTAccelerator™) allowing 0-wait state execution from Flash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

• Memories
– 512 bytes of OTP memory
– Up to 2 MB of Flash memory organized into two banks allowing read-while-write
– Up to 256+4 KB of SRAM including 64-KB of CCM (core coupled memory) data RAM
– Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, Compact Flash/NOR/NAND memories

• LCD parallel interface, 8080/6800 modes

• LCD-TFT controller with fully programmable resolution (total width up to 4096 pixels, total height up to 2048 lines and pixel clock up to 83 MHz)

• Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D)

• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1% accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM

• 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode 2×12-bit D/A converters

• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input

• Debug mode
– SWD & JTAG interfaces
– Cortex-M4 Trace Macrocell™

• Up to 168 I/O ports with interrupt capability
– Up to 164 fast I/Os up to 90 MHz
– Up to 166 5 V-tolerant I/Os

• Up to 21 communication interfaces
– Up to 3 × I2C interfaces (SMBus/PMBus)
– Up to 4 USARTs/4 UARTs (11.25 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
– Up to 6 SPIs (45 Mbits/s), 2 with muxed full-duplex I2S for audio class accuracy via internal audio PLL or external clock
– 1 x SAI (serial audio interface) – 2 × CAN (2.0B Active) and SDIO interface

• Advanced connectivity
– USB 2.0 full-speed device/host/OTG controller with on-chip PHY
– USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
– 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII

• 8- to 14-bit parallel camera interface up to 54 Mbytes/s

• Cryptographic acceleration: hardware acceleration for AES 128, 192, 256, Triple DES, HASH (MD5, SHA-1, SHA-2), and HMAC True random number generator

• CRC calculation unit

• RTC: subsecond accuracy, hardware calendar 96-bit unique ID.

CATALOG

STM32F437IIH6TR COUNTRY OF ORIGIN

STM32F437IIH6TR PARAMETRIC INFO

STM32F437IIH6TR PACKAGE INFO

STM32F437IIH6TR MANUFACTURING INFO

STM32F437IIH6TR PACKAGING INFO

STM32F437IIH6TR ECAD MODELS

COUNTRY OF ORIGIN

France

Korea (Republic of)

Malaysia

Philippines

Singapore

Taiwan (Province of China)

PARAMETRIC INFO

Tradename	STM32
Data Bus Width (bit)	32
Family Name	STM32F
Device Core	ARM Cortex M4
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	180
Program Memory Type	Flash
Program Memory Size	2MB
RAM Size	260KB
Hardware Acceleration	FPU
Trace Hardware	JTAG/SWD
Maximum Dhrystone MIPS (MIPS)	1.25
Encryption Standard	AES
DMA Channels	16
CAN Type	2.0B
Direct Memory Access	Yes
Floating Point Unit	Yes
Bluetooth	No
Wi-Fi	No
Ethernet Interface Type	MII/RMII
Ethernet Speed	10Mbps/100Mbps
Multiply Accumulate	No
Input Capture Channels	4
Output Compare Channels	4
Internal/External Clock Type	Internal/External
Touch Sensing Interface	No
Power On Reset	Yes
Memory Protection Unit	Yes
Temperature Sensor	Yes
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Maximum CPU Frequency (MHz)	180
Number of Programmable I/Os	140
Number of Timers	14
ADC Channels	24/24/24
ADC Resolution (bit)	12/12/12
DAC Channels	2
Core Architecture	ARM
Number of ADCs	Triple
DAC Resolution (bit)	12
Number of DACs	Single
PWM	4
Watchdog	2
Parallel Master Port	No
Real Time Clock	Yes
Special Features	CAN Controller
Interface Type	CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability	Yes
SPI	6
I2C	3
I2S	2
UART	4
USART	4
CAN	2
USB	2
Ethernet	1
Minimum Operating Supply Voltage (V)	1.7
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	UFBGA
Basic Package Type	Ball Grid Array
Pin Count	201
Lead Shape	Ball
PCB	201
Tab	N/R
Package Length (mm)	10
Package Width (mm)	10
Package Height (mm)	0.45
Package Diameter (mm)	N/R
Mounting	Surface Mount
Package Material	Plastic
Package Description	Ultra Fine Pitch Ball Grid Array
Package Family Name	BGA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	SnAg
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years

PACKAGING INFO

Packaging	Tape and Reel
Quantity Of Packaging	10000

ECAD MODELS