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| |
• Dual mode Quad-SPI
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• Clock, reset and supply management– 1.7 V to 3.6 V application supply and I/Os– POR, PDR, PVD and BOR– Dedicated USB power– 4-to-26 MHz crystal oscillator– Internal 16 MHz factory-trimmed RC (1%accuracy)– 32 kHz oscillator for RTC with calibration– Internal 32 kHz RC with calibration
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• Low-power– Sleep, Stop and Standby modes– VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes of backup SRAM
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| • 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode |
| • 2×12-bit D/A converters |
| • Up to 18 timers: up to thirteen 16-bit (1x lowpower 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWMs or pulse counter and quadrature(incremental) encoder inputs. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer |
| • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support |
| • Debug mode– SWD and JTAG interfaces – Cortex®-M7 Trace Macrocell™ |
| • Up to 140 I/O ports with interrupt capability– Up to 136 fast I/Os up to 108 MHz– Up to 138 5 V-tolerant I/Os |
| • Up to 21 communication interfaces– Up to 3× I2C interfaces (SMBus/PMBus)– Up to 4 USARTs/4 UARTs (27 Mbit/s,ISO7816 interface, LIN, IrDA, modemcontrol)– Up to 5 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2Ss for audio class accuracy via internal audio PLL or external clock– 2 x SAIs (serial audio interface) |
| |
| CATALOG |
| STM32F722RCT6 COUNTRY OF ORIGIN |
STM32F722RCT6 PARAMETRIC INFO
|
STM32F722RCT6 PACKAGE INFO
|
STM32F722RCT6 MANUFACTURING INFO
|
STM32F722RCT6 PACKAGING INFO
|
STM32F722RCT6 EACD MODELS
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|
| COUNTRY OF ORIGIN |
| China |
| Philippines |
| Taiwan (Province of China) |
| Malaysia |
|
PARAMETRIC INFO
|
| Tradename |
STM32 |
| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M7 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
216 |
| Program Memory Type |
Flash |
| Program Memory Size |
256KB |
| RAM Size |
276KB |
| Maximum CPU Frequency (MHz) |
216 |
| CAN Type |
2.0B |
| Direct Memory Access |
No |
| Floating Point Unit |
Yes |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Internal/External Clock Type |
Internal/External |
| Touch Sensing Interface |
No |
| Power On Reset |
No |
| Memory Protection Unit |
Yes |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Number of Programmable I/Os |
50 |
| Number of Timers |
14 |
| ADC Channels |
16/16/16 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
12/12/12 |
| Core Architecture |
ARM |
| Number of ADCs |
Triple |
| Number of DACs |
Single |
| DAC Resolution (bit) |
12 |
| PWM |
4 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
No |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
3 |
| I2S |
3 |
| UART |
2 |
| USART |
4 |
| CAN |
1 |
| USB |
2 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
10000 |
|
|
ECAD MODELS
|
|
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