STM32F767IGT6 STMicroelectronics IC MCU 32BIT 1MB FLASH 176LQFP

label:

2023/11/29 208

• Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.

• Memories
– Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write
– SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
– Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories

• Dual mode Quad-SPI

• Graphics
– Chrom-ART Accelerator (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
– Hardware JPEG codec
– LCD-TFT controller supporting up to XGA resolution
– MIPI® DSI host controller supporting up to 720p 30 Hz resolution

• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– Dedicated USB power
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1% accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration

• Low-power
– Sleep, Stop and Standby modes
– VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM

• 3×12-bit, 2.4 MSPS ADC: up to 24 channels

• Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters

• 2×12-bit D/A converters

• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support

• Up to 18 timers: up to thirteen 16-bit (1x lowpower 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer

• Debug mode
– SWD and JTAG interfaces
– Cortex®-M7 Trace Macrocell™

• Up to 168 I/O ports with interrupt capability
– Up to 164 fast I/Os up to 108 MHz
– Up to 166 5 V-tolerant I/Os

• Up to 28 communication interfaces
– Up to 4 I2C interfaces (SMBus/PMBus)
– Up to 4 USARTs/4 UARTs (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
– Up to 6 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2S for audio
– 2 x SAIs (serial audio interface)
– 3 × CANs (2.0B Active) and 2x SDMMCs
– SPDIFRX interface
– HDMI-CEC
– MDIO slave interface

• Advanced connectivity
– USB 2.0 full-speed device/host/OTG controller with on-chip PHY
– USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
– 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII

• 8- to 14-bit camera interface up to 54 Mbyte/s

• True random number generator

• CRC calculation unit

• RTC: subsecond accuracy, hardware calendar

• 96-bit unique ID

CATALOG

STM32F767IGT6 COUNTRY OF ORIGIN

STM32F767IGT6 PARAMETRIC INFO

STM32F767IGT6 PACKAGE INFO

STM32F767IGT6 MANUFACTURING INFO

STM32F767IGT6 PACKAGING INFO

STM32F767IGT6 ECAD MODELS

COUNTRY OF ORIGIN

Taiwan (Province of China)

PARAMETRIC INFO

Tradename	STM32
Data Bus Width (bit)	32
Family Name	STM32F
Device Core	ARM Cortex M7
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	216
Program Memory Type	Flash
Program Memory Size	1MB
RAM Size	532KB
Hardware Acceleration	FPU
Trace Hardware	JTAG/SWD
DMA Channels	16
CAN Type	2.0B
Instruction Cache Size	16KB
Data Cache Size	16KB
Direct Memory Access	No
Floating Point Unit	Yes
Bluetooth	No
Wi-Fi	No
Ethernet Interface Type	MII/RMII
Ethernet Speed	10Mbps/100Mbps
Multiply Accumulate	No
Input Capture Channels	4
Output Compare Channels	4
Internal/External Clock Type	External
Touch Sensing Interface	No
Power On Reset	No
Memory Protection Unit	Yes
Temperature Sensor	Yes
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Maximum CPU Frequency (MHz)	216
Number of Programmable I/Os	132
Number of Timers	15
ADC Channels	24/24/24
ADC Resolution (bit)	12/12/12
DAC Channels	2
Core Architecture	ARM
Number of ADCs	Triple
DAC Resolution (bit)	12
Number of DACs	Single
PWM	4
Watchdog	2
Parallel Master Port	No
Real Time Clock	Yes
Special Features	CAN Controller
Interface Type	CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability	Yes
SPI	6
I2C	4
Process Technology	CMOS
I2S	3
UART	4
USART	4
CAN	3
USB	2
Ethernet	1
Maximum Power Dissipation (mW)	526
Minimum Operating Supply Voltage (V)	1.7
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	176
Lead Shape	Gull-wing
PCB	176
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	24.1(Max)
Package Width (mm)	24.1(Max)
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	26.1(Max)
Package Overall Width (mm)	26.1(Max)
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Lead Finish(Plating)	Matte Sn
Shelf Life Period	2 Years

PACKAGING INFO

Packaging	Tray
Quantity Of Packaging	10000

ECAD MODELS