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• Includes ST state-of-the-art patented technology
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• Dual mode Quad-SPI
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• Graphics– Chrom-ART Accelerator (DMA2D),graphical hardware accelerator enabling enhanced graphical user interface– Hardware JPEG codec
– LCD-TFT controller supporting up to XGAresolution– MIPI® DSI host controller supporting up to720p 30 Hz resolution
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| • RFI filtered inputs |
| • Low-power– Sleep, Stop and Standby modes– VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM |
| • 3×12-bit, 2.4 MSPS ADC: up to 24 channels |
| • Digital filters for sigma delta modulator(DFSDM), 8 channels / 4 filters |
| • 2×12-bit D/A converters |
| • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support |
• Up to 18 timers: up to thirteen 16-bit (1x lowpower 16-bit timer available in Stop mode) and two 32-bit timers, each with up to four
IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer |
| • Debug mode– SWD and JTAG interfaces– Cortex®-M7 Trace Macrocell™ |
| • Up to 168 I/O ports with interrupt capability– Up to 164 fast I/Os up to 108 MHz– Up to 166 5 V-tolerant I/Os |
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| CATALOG |
| STM32F769NIH6 COUNTRY OF ORIGIN |
STM32F769NIH6 PARAMETRIC INFO
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STM32F769NIH6 PACKAGE INFO
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STM32F769NIH6 MANUFACTURING INFO
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STM32F769NIH6 PACKAGING INFO
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STM32F769NIH6 EACD MODELS
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| COUNTRY OF ORIGIN |
| Philippines |
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PARAMETRIC INFO
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| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Series name |
STM32F |
| Device Core |
ARM Cortex M7 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
216 |
| Program Memory Type |
Flash |
| Program Memory Size |
2MB |
| RAM Size |
532KB |
| Maximum CPU Frequency (MHz) |
216 |
| Hardware Acceleration |
FPU |
| Trace Hardware |
JTAG/SWD |
| DMA Channels |
16 |
| CAN Type |
2.0B |
| Instruction Cache Size |
16KB |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Data Cache Size |
16KB |
| Direct Memory Access |
no |
| Floating Point Unit |
yes |
| Bluetooth |
no |
| Wi-Fi |
no |
| Multiply Accumulate |
no |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Internal/External Clock Type |
External |
| Touch Sensing Interface |
no |
| Power On Reset |
no |
| Memory Protection Unit |
yes |
| Temperature Sensor |
yes |
| DDR |
no |
| Memory Management Unit |
no |
| Integrated Development Environment |
no |
| Super Scalar |
no |
| External Bus Interface |
no |
| Number of Programmable I/Os |
159 |
| Number of Timers |
15 |
| ADC Channels |
24/24/24 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
12/12/12 |
| Number of ADCs |
Triple |
| Core Architecture |
ARM |
| Number of DACs |
Single |
| DAC Resolution (bit) |
12 |
| PWM |
2 |
| Watchdog |
2 |
| Parallel Master Port |
no |
| Real Time Clock |
yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB |
| Programmability |
yes |
| SPI |
6 |
| I2C |
4 |
| I2S |
3 |
| Process Technology |
CMOS |
| UART |
4 |
| USART |
4 |
| CAN |
3 |
| USB |
2 |
| Ethernet |
1 |
| Maximum Power Dissipation (mW) |
690 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Rating |
Industrial |
| Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier packaging |
TFBGA |
| Basic package type |
Ball Grid Array |
| Number of pins |
216 |
| Pin shape |
Ball |
| PCB |
216 |
| ears |
N/R |
| Pin spacing (mm) |
0.8 |
| Package length (mm) |
13 |
| Package width (mm) |
13 |
| Package height (mm) |
0.76 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
1.1(Max) |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Thin Fine Pitch Ball Grid Array |
| Package series name |
BGA |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Package |
Tray |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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