STM32L072RBT6 STMicroelectronics IC MCU 32BIT 128KB FLASH 64LQFP

label:
2023/12/29 175



CATALOG
STM32L072RBT6 COUNTRY OF ORIGIN
STM32L072RBT6 PARAMETRIC INFO
STM32L072RBT6 PACKAGE INFO
STM32L072RBT6 MANUFACTURING INFO
STM32L072RBT6 PACKAGING INFO
STM32L072RBT6 ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
Taiwan (Province of China)
Philippines
China


PARAMETRIC INFO
Tradename STM32
Data Bus Width (bit) 32
Family Name STM32L
Device Core ARM Cortex M0+
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 32
Program Memory Type Flash
Program Memory Size 128KB
RAM Size 20KB
Maximum CPU Frequency (MHz) 32
Number of Programmable I/Os 51
Number of Timers 7
ADC Channels 16
DAC Channels 2
ADC Resolution (bit) 12
Number of ADCs Single
Core Architecture ARM
Number of DACs Single
DAC Resolution (bit) 12
Watchdog 2
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Interface Type I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 2
I2C 3
I2S 1
UART 1
USART 4
CAN 0
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 435
Minimum Operating Supply Voltage (V) 1.65
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 64
Lead Shape Gull-wing
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 12
Package Overall Width (mm) 12
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BCD
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray


ECAD MODELS


Продукт RFQ