STM32L081KZU6 STMicroelectronicsIC MCU 32BIT 192KB FLASH 32QFPN

label:

2024/02/26 187

• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40 to 125 °C temperature range
– 0.29 µA Standby mode (3 wakeup pins)
– 0.43 µA Stop mode (16 wakeup lines)
– 0.86 µA Stop mode + RTC + 20-Kbyte RAMretention
– Down to 93 µA/MHz in Run mode
– 5 µs wakeup time (from Flash memory)
– 41 µA 12-bit ADC conversion at 10 ksps

• Core: Arm® 32-bit Cortex®-M0+ with MPU
– From 32 kHz up to 32 MHz max.
– 0.95 DMIPS/MHz

• Memories
– Up to 192-Kbyte Flash memory with ECC(2banks with read-while-write capability)
– 20 -Kbyte RAM
– 6 Kbytes of data EEPROM with ECC
– 20-byte backup register
– Sector protection against R/W operation

• Up to 40 fast I/Os (31 I/Os 5V tolerant)

• Reset and supply management
– Ultra-safe, low-power BOR (brownout reset)with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)

• Clock sources
– 1 to 25 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High speed internal 16 MHz factory-trimmed RC(+/- 1%)
– Internal low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to4.2 MHz RC
– PLL for CPU clock

• Pre-programmed bootloader
– USART, I2C, SPI supported

• Development support
– Serial wire debug supported

• Rich Analog peripherals
– 12-bit ADC 1.14 Msps up to 16 channels (downto 1.65 V)
– 2x ultra-low-power comparators (window modeand wake up capability, down to 1.65 V)

• 7-channel DMA controller, supporting ADC, SPI,I2C, USART, Timers, AES

• Up to 10x peripheral communication interfaces
– 4x USART (2 with ISO 7816, IrDA), 1x UART(low power)
– Up to 6x SPI 16 Mbits/s
– 3x I2C (2 with SMBus/PMBus)

• 11x timers: 2x 16-bit with up to 4 channels, 2x 16-bitwith up to 2 channels, 1x 16-bit ultra-low-powertimer, 1x SysTick, 1x RTC, 2x 16-bit basic, and 2xwatchdogs (independent/window)

• CRC calculation unit, 96-bit unique ID

• Hardware Encryption Engine AES 128-bit

• All packages are ECOPACK2

CATALOG

STM32L081KZU6 COUNTRY OF ORIGIN

STM32L081KZU6 PARAMETRIC INFO

STM32L081KZU6 PACKAGE INFO

STM32L081KZU6 MANUFACTURING INFO

STM32L081KZU6 PACKAGING INFO

STM32L081KZU6 ECAD MODELS

COUNTRY OF ORIGIN

Philippines

China

PARAMETRIC INFO

Tradename	STM32
Data Bus Width (bit)	32
Family Name	STM32L
Device Core	ARM Cortex M0+
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	32
Program Memory Type	Flash
Program Memory Size	192KB
RAM Size	20KB
Maximum CPU Frequency (MHz)	32
Encryption Standard	AES
DMA Channels	7
EEPROM	6KB
Direct Memory Access	Yes
Floating Point Unit	No
Bluetooth	No
Wi-Fi	No
Multiply Accumulate	No
Input Capture Channels	2
Output Compare Channels	2
Internal/External Clock Type	Internal/External
Touch Sensing Interface	No
Power On Reset	No
Memory Protection Unit	Yes
Temperature Sensor	Yes
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Number of Programmable I/Os	25
Number of Timers	7
ADC Channels	10
ADC Resolution (bit)	12
Number of ADCs	Single
Core Architecture	ARM
Watchdog	2
Analog Comparators	2
Parallel Master Port	No
Real Time Clock	Yes
Interface Type	I2C/SPI/UART/USART
Programmability	Yes
SPI	1
I2C	2
I2S	0
UART	1
USART	3
CAN	0
USB	0
Ethernet	0
Maximum Power Dissipation (mW)	333
Minimum Operating Supply Voltage (V)	1.8
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	UFQFPN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	32
Lead Shape	No Lead
PCB	32
Tab	N/R
Package Length (mm)	5
Package Width (mm)	5
Package Height (mm)	0.55
Package Diameter (mm)	N/R
Mounting	Surface Mount
Package Material	Plastic
Package Family Name	QFP
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging

Tray

ECAD MODELS