STM32L152C6U6A STMicroelectronics IC MCU 32BIT 32KB FLASH 48UFQFPN

label:
2024/06/13 184




CATALOG
STM32L152C6U6A COUNTRY OF ORIGIN
STM32L152C6U6A PARAMETRIC INFO
STM32L152C6U6A PACKAGE INFO
STM32L152C6U6A MANUFACTURING INFO
STM32L152C6U6A PACKAGING INFO
STM32L152C6U6A EACD MODELS



COUNTRY OF ORIGIN
Malaysia
China
Philippines



PARAMETRIC INFO
Family Name STM32L
Data Bus Width (bit) 32
Device Core ARM Cortex M3
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 32
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 16KB
Maximum CPU Frequency (MHz) 32
Trace Hardware JTAG
Maximum Dhrystone MIPS (MIPS) 1.25
DMA Channels 7
EEPROM 4KB
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Input Capture Channels 4
Output Compare Channels 4
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset Yes
Memory Protection Unit Yes
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Number of Programmable I/Os 37
Number of Timers 8
ADC Channels 14
DAC Channels 2/2
ADC Resolution (bit) 12
Core Architecture ARM
Number of ADCs Single
Number of DACs Dual
DAC Resolution (bit) 12/12
PWM 4
Watchdog 2
LCD Segments 72
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Special Features LCD Controller
Interface Type I2C/SPI/USART/USB
Programmability Yes
SPI 2
I2C 2
I2S 0
Process Technology CMOS
UART 0
USART 3
CAN 0
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65



PACKAGE INFO
Supplier Package UFQFPN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 48
Lead Shape No Lead
PCB 48
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 0.55
Package Diameter (mm) N/R
Package Overall Length (mm) 7
Package Overall Width (mm) 7
Package Overall Height (mm) 0.57
Seated Plane Height (mm) 0.57
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Ultra Thin Fine Pitch Quad Flat Package No Lead, Exposed Pad
Package Family Name QFP
Package Outline Link to Datasheet
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material Ag
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years



PACKAGING INFO
Packaging Tray
Quantity Of Packaging 10000



ECAD MODELS




Продукт RFQ