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• Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait-state execution
from Flash memory, frequency up to 80 MHz,
MPU, 100DMIPS and DSP instructions
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• Ultra-low-power with FlexPowerControl
– 1.71 V to 3.6 V power supply
– -40 °C to 85/105/125 °C temperature range
– 200 nA in VBAT mode: supply for RTC and
32x32-bit backup registers
– 8 nA Shutdown mode (5 wakeup pins)
– 28 nA Standby mode (5 wakeup pins)
– 280 nA Standby mode with RTC
– 1.0 µA Stop 2 mode, 1.28 µA with RTC
– 84 µA/MHz run mode
– Batch acquisition mode (BAM)
– 4 µs wakeup from Stop mode
– Brown out reset (BOR)
– Interconnect matrix
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• Performance benchmark
– 1.25 DMIPS/MHz (Drystone 2.1)
– 273.55 CoreMark® (3.42 CoreMark/MHz @
80 MHz)
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• Energy benchmark
– 176.7 ULPBench® score
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• Clock Sources
– 4 to 48 MHz crystal oscillator
– 32 kHz crystal oscillator for RTC (LSE)
– Internal 16 MHz factory-trimmed RC (±1%)
– Internal low-power 32 kHz RC (±5%)
– Internal multispeed 100 kHz to 48 MHz
oscillator, auto-trimmed by LSE (better than
±0.25 % accuracy)
– Internal 48 MHz with clock recovery
– 2 PLLs for system clock, audio, ADC
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• Up to 83 fast I/Os, most 5 V-tolerant
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• RTC with HW calendar, alarms and calibration
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• Up to 21 capacitive sensing channels: support
touchkey, linear and rotary touch sensors
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• 11x timers: 1x 16-bit advanced motor-control,
1x 32-bit and 2x 16-bit general purpose, 2x 16-
bit basic, 2x low-power 16-bit timers (available
in Stop mode), 2x watchdogs, SysTick timer
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• 11 timers
– One 16-bit advanced-control timer for
six-channel PWM output
– Up to seven 16-bit timers, with up to four
IC/OC, OCN, usable for IR control
decoding
– Independent and system watchdog timers
– SysTick timer
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• Memories
– Up to 256 KB single bank Flash,
proprietary code readout protection
– 64 KB of SRAM including 16 KB with
hardware parity check
– Quad SPI memory interface
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• Rich analog peripherals (independent supply)
– 1x 12-bit ADC 5 Msps, up to 16-bit with
hardware oversampling, 200 µA/Msps
– 2x 12-bit DAC output channels, low-power
sample and hold
– 1x operational amplifier with built-in PGA
– 2x ultra-low-power comparators
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• 14-channel DMA controller
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CATALOG |
STM32L431RCT6 COUNTRY OF ORIGIN
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STM32L431RCT6 PARAMETRIC INFO
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STM32L431RCT6 PACKAGE INFO
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STM32L431RCT6 MANUFACTURING INFO
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STM32L431RCT6 PACKAGING INFO
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STM32L431RCT6 ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Philippines
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Malaysia
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Taiwan (Province of China)
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PARAMETRIC INFO
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Data Bus Width (bit) |
32 |
Family Name |
STM32L |
Device Core |
ARM Cortex M4 |
Instruction Set Architecture |
RISC |
Maximum Clock Rate (MHz) |
80 |
Program Memory Type |
Flash |
Program Memory Size |
256KB |
RAM Size |
64KB |
Maximum CPU Frequency (MHz) |
80 |
Number of Programmable I/Os |
52 |
Number of Timers |
9 |
ADC Channels |
16 |
ADC Resolution (bit) |
12 |
DAC Channels |
2 |
Core Architecture |
ARM |
Number of ADCs |
Single |
DAC Resolution (bit) |
12 |
Number of DACs |
Single |
PWM |
1 |
Watchdog |
2 |
Analog Comparators |
2 |
Parallel Master Port |
No |
Real Time Clock |
Yes |
Special Features |
CAN Controller |
Interface Type |
CAN/I2C/SPI/UART/USART |
Programmability |
Yes |
SPI |
3 |
I2C |
3 |
I2S |
0 |
UART |
1 |
USART |
3 |
CAN |
1 |
USB |
0 |
Ethernet |
0 |
Maximum Power Dissipation (mW) |
444 |
Minimum Operating Supply Voltage (V) |
1.71 |
Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Industrial |
Operating Supply Voltage (V) |
1.8|2.5|3.3 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
64 |
Lead Shape |
Gull-wing |
PCB |
64 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
10 |
Package Width (mm) |
10 |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
12 |
Package Overall Width (mm) |
12 |
Package Overall Height (mm) |
1.6(Max) |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BCD |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
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PACKAGING INFO
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ECAD MODELS
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