STM32L431RCT6 STMicroelectronics Ultra-low-power Arm® Cortex®-M4 32-bit MCU+FPU, 100DMIPS, up to 256KB Flash, 64KB SRAM, analog, audio

label:
2023/12/1 199



• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS and DSP instructions
• Ultra-low-power with FlexPowerControl – 1.71 V to 3.6 V power supply – -40 °C to 85/105/125 °C temperature range – 200 nA in VBAT mode: supply for RTC and 32x32-bit backup registers – 8 nA Shutdown mode (5 wakeup pins) – 28 nA Standby mode (5 wakeup pins) – 280 nA Standby mode with RTC – 1.0 µA Stop 2 mode, 1.28 µA with RTC – 84 µA/MHz run mode – Batch acquisition mode (BAM) – 4 µs wakeup from Stop mode – Brown out reset (BOR) – Interconnect matrix
• Performance benchmark – 1.25 DMIPS/MHz (Drystone 2.1) – 273.55 CoreMark® (3.42 CoreMark/MHz @ 80 MHz)
• Energy benchmark – 176.7 ULPBench® score
• Clock Sources – 4 to 48 MHz crystal oscillator – 32 kHz crystal oscillator for RTC (LSE) – Internal 16 MHz factory-trimmed RC (±1%) – Internal low-power 32 kHz RC (±5%) – Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy) – Internal 48 MHz with clock recovery – 2 PLLs for system clock, audio, ADC
• Up to 83 fast I/Os, most 5 V-tolerant
• RTC with HW calendar, alarms and calibration
• Up to 21 capacitive sensing channels: support touchkey, linear and rotary touch sensors
• 11x timers: 1x 16-bit advanced motor-control, 1x 32-bit and 2x 16-bit general purpose, 2x 16- bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer
• 11 timers – One 16-bit advanced-control timer for six-channel PWM output – Up to seven 16-bit timers, with up to four IC/OC, OCN, usable for IR control decoding – Independent and system watchdog timers – SysTick timer
• Memories – Up to 256 KB single bank Flash, proprietary code readout protection – 64 KB of SRAM including 16 KB with hardware parity check – Quad SPI memory interface
• Rich analog peripherals (independent supply) – 1x 12-bit ADC 5 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps – 2x 12-bit DAC output channels, low-power sample and hold – 1x operational amplifier with built-in PGA – 2x ultra-low-power comparators
• 14-channel DMA controller


CATALOG
STM32L431RCT6 COUNTRY OF ORIGIN
STM32L431RCT6 PARAMETRIC INFO
STM32L431RCT6 PACKAGE INFO
STM32L431RCT6 MANUFACTURING INFO
STM32L431RCT6 PACKAGING INFO
STM32L431RCT6 ECAD MODELS


COUNTRY OF ORIGIN
China
Philippines
Malaysia
Taiwan (Province of China)


PARAMETRIC INFO
Data Bus Width (bit) 32
Family Name STM32L
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 80
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 64KB
Maximum CPU Frequency (MHz) 80
Number of Programmable I/Os 52
Number of Timers 9
ADC Channels 16
ADC Resolution (bit) 12
DAC Channels 2
Core Architecture ARM
Number of ADCs Single
DAC Resolution (bit) 12
Number of DACs Single
PWM 1
Watchdog 2
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/I2C/SPI/UART/USART
Programmability Yes
SPI 3
I2C 3
I2S 0
UART 1
USART 3
CAN 1
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 444
Minimum Operating Supply Voltage (V) 1.71
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 64
Lead Shape Gull-wing
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 12
Package Overall Width (mm) 12
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BCD
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray


ECAD MODELS


Продукт RFQ