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• Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait-state execution
from Flash memory, frequency up to 80 MHz,
MPU, 100DMIPS and DSP instructions
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• Ultra-low-power with FlexPowerControl
– 1.71 V to 3.6 V power supply
– -40 °C to 85/105/125 °C temperature range
– 200 nA in VBAT mode: supply for RTC and
32x32-bit backup registers
– 8 nA Shutdown mode (5 wakeup pins)
– 28 nA Standby mode (5 wakeup pins)
– 280 nA Standby mode with RTC
– 1.0 µA Stop 2 mode, 1.28 µA with RTC
– 84 µA/MHz run mode
– Batch acquisition mode (BAM)
– 4 µs wakeup from Stop mode
– Brown out reset (BOR)
– Interconnect matrix
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• Performance benchmark
– 1.25 DMIPS/MHz (Drystone 2.1)
– 273.55 CoreMark® (3.42 CoreMark/MHz @
80 MHz)
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• Energy benchmark
– 174.5 ULPBench® score
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• Clock Sources
– 4 to 48 MHz crystal oscillator
– 32 kHz crystal oscillator for RTC (LSE)
– Internal 16 MHz factory-trimmed RC (±1%)
– Internal low-power 32 kHz RC (±5%)
– Internal multispeed 100 kHz to 48 MHz
oscillator, auto-trimmed by LSE (better than
±0.25 % accuracy)
– Internal 48 MHz with clock recovery
– 2 PLLs for system clock, audio, ADC
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• Up to 83 fast I/Os, most 5 V-tolerant
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• RTC with HW calendar, alarms and calibration
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• Up to 21 capacitive sensing channels: support
touchkey, linear and rotary touch sensors
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• 11x timers: 1x 16-bit advanced motor-control,
1x 32-bit and 2x 16-bit general purpose, 2x 16-
bit basic, 2x low-power 16-bit timers (available
in Stop mode), 2x watchdogs, SysTick timer
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• 11 timers
– One 16-bit advanced-control timer for
six-channel PWM output
– Up to seven 16-bit timers, with up to four
IC/OC, OCN, usable for IR control
decoding
– Independent and system watchdog timers
– SysTick timer
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• Memories
– Up to 512 KB single bank Flash,
proprietary code readout protection
– 160 KB of SRAM including 32 KB with
hardware parity check
– Quad SPI memory interface
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• Rich analog peripherals (independent supply)
– 1x 12-bit ADC 5 Msps, up to 16-bit with
hardware oversampling, 200 µA/Msps
– 2x 12-bit DAC output channels, low-power
sample and hold
– 1x operational amplifier with built-in PGA
– 2x ultra-low-power comparators
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• 14-channel DMA controller
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| CATALOG |
STM32L451RET6TR COUNTRY OF ORIGIN
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STM32L451RET6TR PARAMETRIC INFO
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STM32L451RET6TR PACKAGE INFO
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STM32L451RET6TR MANUFACTURING INFO
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STM32L451RET6TR PACKAGING INFO
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STM32L451RET6TR ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Philippines
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Malaysia
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Tradename |
STM32 |
| Data Bus Width (bit) |
32 |
| Family Name |
STM32L |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
80 |
| Program Memory Type |
Flash |
| Program Memory Size |
512KB |
| RAM Size |
160KB |
| Maximum CPU Frequency (MHz) |
80 |
| Number of Programmable I/Os |
52 |
| Number of Timers |
9 |
| ADC Channels |
16 |
| ADC Resolution (bit) |
12 |
| DAC Channels |
1 |
| Core Architecture |
ARM |
| Number of ADCs |
Single |
| DAC Resolution (bit) |
12 |
| Number of DACs |
Single |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/SPI/UART/USART |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
4 |
| I2S |
0 |
| UART |
1 |
| USART |
3 |
| CAN |
1 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
345 |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
3.3 |
|
|
PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
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ECAD MODELS
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