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• AEC-Q100 qualified
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• Core– Max fCPU: 16 MHz– Advanced STM8A core with Harvard architecture and 3-stage pipeline– Extended instruction set
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• Memories– Program memory: 4 to 8 Kbyte Flash program; data retention 20 years at 55 °C after 1 kcycle– Data memory: 640 byte true data EEPROM; endurance 300 kcycle– RAM: 1 Kbyte
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| • Clock management– Low-power crystal resonator oscillator with external clock input– Internal, user-trimmable 16 MHz RC and low-power 128 kHz RC oscillators– Clock security system with clock monitor |
| • Reset and supply management– Wait/auto-wakeup/Halt low-power modes with user definable clock gating– Low-consumption power-on and powerdown reset |
| • Interrupt management– Nested interrupt controller with 32 interrupts– Up to 28 external interrupts on 7 vectors |
| • Timers– Advanced control timer: 16-bit, 4 CAPCOM channels, 3 complementary outputs, deadtime insertion and flexible synchronization– 16-bit general purpose timer with 3 CAPCOM channels each (IC, OC, PWM)– 8-bit AR basic timer with 8-bit prescaler– Auto-wakeup timer– Window and independent watchdog timers |
| • I/Os– Up to 28 I/Os on a 32-pin package including 21 high sink outputs– Highly robust I/O design, immune against current injection |
| • Communication interfaces– LINUART LIN 2.2 compliant, master/slave modes with automatic resynchronization– SPI interface up to 8 Mbit/s or fMASTER/2– I2C interface up to 400 Kbit/s |
| • Analog to digital converter (ADC)– 10-bit, ± 1 LSB ADC with up to 7 muxed channels + 1 internal channel, scan mode and analog watchdog– Internal reference voltage measurement |
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| CATALOG |
| STM8AF6223PCX COUNTRY OF ORIGIN |
STM8AF6223PCX PARAMETRIC INFO
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STM8AF6223PCX PACKAGE INFO
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STM8AF6223PCX MANUFACTURING INFO
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STM8AF6223PCX PACKAGING INFO
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STM8AF6223PCX EACD MODELS
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| COUNTRY OF ORIGIN |
| Philippines |
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PARAMETRIC INFO
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| Family Name |
STM8A |
| Data Bus Width (bit) |
8 |
| Device Core |
STM8A |
| Instruction Set Architecture |
CISC |
| Maximum Clock Rate (MHz) |
16 |
| Program Memory Type |
Flash |
| Program Memory Size |
8KB |
| RAM Size |
1KB |
| Maximum Expanded Memory Size |
16MB |
| Maximum CPU Frequency (MHz) |
16 |
| Number of Programmable I/Os |
16 |
| Number of Timers |
8 |
| ADC Channels |
5 |
| ADC Resolution (bit) |
10 |
| Core Architecture |
STM8 |
| Number of ADCs |
Single |
| PWM |
3 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
No |
| Interface Type |
I2C/SPI/UART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| UART |
1 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
45 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Automotive |
| Operating Supply Voltage (V) |
3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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