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• Core– Max fCPU: up to 24 MHz, 0 wait states @ fCPU 16 MHz– Advanced STM8 core with Harvard architecture and 3-stage pipeline– Extended instruction set– Max 20 MIPS @ 24 MHz
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• Memories– Program: up to 128 Kbytes Flash; data retention 20 years at 55 °C after 10 kcycles– Data: up to 2 Kbytes true data EEPROM;endurance 300 kcycles– RAM: up to 6 Kbytes
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• Clock, reset and supply management– 2.95 to 5.5 V operating voltage– Low power crystal resonator oscillator– External clock input– Internal, user-trimmable 16 MHz RC– Internal low power 128 kHz RC– Clock security system with clock monitor– Wait, active-halt, & halt low power modes
– Peripheral clocks switched off individually– Permanently active, low consumption power-on and power-down reset
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| • Interrupt management– Nested interrupt controller with 32 interrupts– Up to 37 external interrupts on 6 vectors |
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| CATALOG |
| STM8S208C8T6 COUNTRY OF ORIGIN |
STM8S208C8T6 PARAMETRIC INFO
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STM8S208C8T6 PACKAGE INFO
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STM8S208C8T6 MANUFACTURING INFO
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STM8S208C8T6 PACKAGING INFO
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STM8S208C8T6 EACD MODELS
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| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
| Philippines |
| Malaysia |
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PARAMETRIC INFO
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| Family Name |
STM8S |
| Data Bus Width (bit) |
8 |
| Device Core |
STM8 |
| Instruction Set Architecture |
CISC |
| Maximum Clock Rate (MHz) |
24 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
6KB |
| Maximum Expanded Memory Size |
16MB |
| Maximum CPU Frequency (MHz) |
24 |
| Number of Programmable I/Os |
38 |
| Number of Timers |
4 |
| ADC Channels |
16 |
| ADC Resolution (bit) |
10 |
| Core Architecture |
STM8 |
| Number of ADCs |
Single |
| PWM |
1 |
| Watchdog |
2 |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/SPI/UART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| UART |
2 |
| USART |
0 |
| CAN |
1 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
443 |
| Minimum Operating Supply Voltage (V) |
2.95 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
Gull-wing |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7 |
| Package Width (mm) |
7 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BBC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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ECAD MODELS
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