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■ Very small conduction losses
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■ Negligible switching losses
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■ Extremely fast switching
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■ Low forward voltage drop for higher efficiency and extented battery life
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■ Low thermal resistance
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■ Avalanche capability specified
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| CATALOG |
STPS1L40M COUNTRY OF ORIGIN
|
STPS1L40M PARAMETRIC INFO
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STPS1L40M PACKAGE INFO
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STPS1L40M MANUFACTURING INFO
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STPS1L40M PACKAGING INFO
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STPS1L40M ECAD MODELS
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|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
40 |
| Maximum Continuous Forward Current (A) |
1 |
| Maximum Junction Case Thermal Resistance |
20°C/W |
| Peak Forward Voltage (V) |
0.6@3A |
| Peak Non-Repetitive Surge Current (A) |
50 |
| Peak Reverse Current (uA) |
63 |
| Operating Junction Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
ST Mite |
| Pin Count |
2 |
| PCB |
1 |
| Tab |
Tab |
| Package Length (mm) |
1.9 |
| Package Width (mm) |
1.9 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.75 |
| Package Overall Width (mm) |
1.9 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
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ECAD MODELS
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