STR710FZ2T6 STMicroelectronics Semiconductors IC MCU 32BIT 256KB FLASH 144TQFP

label:
2025/03/5 75
STR710FZ2T6 STMicroelectronics Semiconductors 	IC MCU 32BIT 256KB FLASH 144TQFP


CATALOG
STR710FZ2T6 COUNTRY OF ORIGIN
STR710FZ2T6 PARAMETRIC INFO
STR710FZ2T6 PACKAGE INFO
STR710FZ2T6 MANUFACTURING INFO
STR710FZ2T6 PACKAGING INFO
STR710FZ2T6 ECAD MODELS


COUNTRY OF ORIGIN
Malta


PARAMETRIC INFO
Family Name STR7
Data Bus Width (bit) 32
Device Core ARM7TDMI
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 66
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 64KB
Maximum Expanded Memory Size 4GB
Maximum CPU Frequency (MHz) 66
Number of Programmable I/Os 48
Number of Timers 4
ADC Channels 4
ADC Resolution (bit) 12
Core Architecture ARM
Number of ADCs 1
PWM 1
Watchdog 1
Special Features CAN Controller
Interface Type CAN/I2C/SPI/UART/USB
Programmability Yes
SPI 2
I2C 2
I2S 0
UART 4
USART 0
CAN 1
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 10000


ECAD MODELS


Продукт RFQ