STW65N65DM2AG STMicroelectronics MOSFET N-CH 650V 60A

label:
2023/08/23 326

 
• Designed for automotive applications and AEC-Q101 qualified
• Fast-recovery body diode  
• Extremely low gate charge and input capacitance
• Low on-resistance
• 100% avalanche tested
• Extremely high dv/dt ruggedness  
• Zener-protected

 
CATALOG
STW65N65DM2AG COUNTRY OF ORIGIN
STW65N65DM2AG PARAMETRIC INFO
STW65N65DM2AG PACKAGE INFO
STW65N65DM2AG MANUFACTURING INFO
STW65N65DM2AG ACKAGING INFO
STW65N65DM2AG ECAD MODELS
STW65N65DM2AG APPLICATIONS

 
COUNTRY OF ORIGIN  
China


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 650
Maximum Continuous Drain Current (A) 60
Maximum Gate Source Voltage (V) ±25
Maximum Drain Source Resistance (mOhm) 50@10V
Typical Gate Charge @ Vgs (nC) 120@10V
Typical Gate Charge @ 10V (nC) 120
Maximum Power Dissipation (mW) 446000
Process Technology MDmesh DM2
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 5500@100V
Typical Turn-On Delay Time (ns) 33
Typical Turn-Off Delay Time (ns) 114
Typical Fall Time (ns) 11.5
Typical Rise Time (ns) 13.5
Maximum Gate Source Leakage Current (nA) 5000
Maximum Gate Threshold Voltage (V) 5
Maximum IDSS (uA) 10
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Tradename Mdmesh™
Supplier Temperature Grade Automotive
 

Package Info
Supplier Package TO-247
Basic Package Type Through Hole
Pin Count 3
Lead Shape Through Hole
PCB 3
Tab Tab
Pin Pitch (mm) 5.45
Package Length (mm) 15.75(Max)
Package Width (mm) 5.15(Max)
Package Height (mm) 20.15(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 15.75(Max)
Package Overall Width (mm) 5.15(Max)
Package Overall Height (mm) 24.45(Max)
Seated Plane Height (mm) 24.45(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Transistor Outline Package
Package Family Name TO
Jedec TO-247
 

Manufacturing Info
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles 2

      
Packaging Info
Packaging Tube
Quantity Of Packaging 30
Packaging Document Link to Datasheet

      
ECAD MODELS

 
APPLICATIONS
• Switching applications

 
Продукт RFQ