
|
|
• LoRaTM Modem
|
• 168 dB maximum link budget
|
• +20 dBm - 100 mW constant RF output vs. V supply
|
• +14 dBm high efficiency PA |
• Programmable bit rate up to 300 kbps |
• High sensitivity: down to -148 dBm |
• Bullet-proof front end: IIP3 = -11 dBm |
• Excellent blocking immunity |
• Low RX current of 9.9 mA, 200 nA register retention |
• Fully integrated synthesizer with a resolution of 61 Hz |
|
CATALOG |
SX1276IMLTRT COUNTRY OF ORIGIN |
SX1276IMLTRT PARAMETRIC INFO
|
SX1276IMLTRT PACKAGE INFO
|
SX1276IMLTRT MANUFACTURING INFO
|
SX1276IMLTRT PACKAGING INFO
|
SX1276IMLTRT EACD MODELS
|
SX1276IMLTRT APPLICATIONS |
|
COUNTRY OF ORIGIN |
Taiwan (Province of China) |
Malaysia |
|
PARAMETRIC INFO
|
Category |
Transceiver |
Maximum RF Operating Frequency Range (MHz) |
500 to 1500 |
Modulation Technique |
FSK/GFSK/GMSK/MSK/OOK |
Maximum Data Rate |
300Kbps |
Operating Band Frequency (MHz) |
137 to 1020 |
Maximum RF Operating Frequency (MHz) |
1020 |
Solutions |
ISM |
Typical Transmitter Output Power (dBm) |
14 |
Typical Receiver Sensitivity (dBm) |
-148 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Typical Operating Supply Voltage |
3.3V |
Minimum Operating Supply Voltage |
1.8V |
Operating Supply Voltage |
3.3V |
Maximum Operating Supply Voltage |
3.7V |
|
|
PACKAGE INFO
|
Supplier Package |
QFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
28 |
Lead Shape |
No Lead |
PCB |
28 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
6 |
Package Width (mm) |
6 |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Jedec |
MO-220VJJC |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
APPLICATIONS |
• Automated Meter Reading. |
• Home and Building Automation. |
• Wireless Alarm and Security Systems. |
• Industrial Monitoring and Control |
• Long range Irrigation Systems |
|