SY89113UMY Microchip Technology IC CLK BUFFER 2:12 1GHZ 44MLF

label:
2025/06/12 15
SY89113UMY Microchip Technology IC CLK BUFFER 2:12 1GHZ 44MLF


• Selects between 1 of 2 Inputs, and Provides 12 Precision, Low Skew LVDS Output Copies
• Ultra-low Jitter Design:- 130 fs RMS Phase Jitter (Typ)- 0.7 psRMS Crosstalk Induced Jitter
• Unique, Patent-pending 2:1 Input MUX Provides Superior Isolation to Minimize Channel-to-Channel Crosstalk
• CLK0 Input Features a Unique, Patent-pending Input Termination and VT Pin that Accepts ACand DC-coupled Inputs (CML, LVPEC
• 325 mV LVDS-compatible Output Swing
• Power Supply: 2.5V ±5%


CATALOG
SY89113UMY COUNTRY OF ORIGIN
SY89113UMY PARAMETRIC INFO
SY89113UMY PACKAGE INFO
SY89113UMY MANUFACTURING INFO
SY89113UMY PACKAGING INFO
SY89113UMY ECAD MODELS
SY89113UMY APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Thailand


PARAMETRIC INFO
Type Fanout Buffer
Fanout 1:12
Number of Outputs per Chip 12
Input Logic Level CML|CMOS|HSTL|LVDS|LVPECL|TTL
Output Logic Level LVDS
Minimum Operating Supply Voltage (V) 2.375
Maximum Operating Supply Voltage (V) 2.625
Minimum Output Frequency (MHz) 1000
Minimum Input Frequency (MHz) 1000
Output Signal Type Differential
Maximum Output Skew (ps) 25
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Operating Supply Voltage (V) 2.5
Maximum Quiescent Current (mA) 330
Number of Clock Inputs 2
Spread Spectrum No
Input Signal Type Differential
Power Supply Type Single
Configuration 1 x 2:1
Maximum Propagation Delay Time @ Maximum CL (ns) 1.2@2.375V to 2.625V
Absolute Propagation Delay Time (ns) 1.2


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 44
Lead Shape No Lead
PCB 44
Tab N/R
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 0.85(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 260


ECAD MODELS


APPLICATIONS
• Multi-processor Server
• SONET/SDH Clock/Data Distribution
• Fibre Channel Distribution
• Gigabit Ethernet Clock Distribution
Продукт RFQ