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• Selects between 1 of 2 Inputs, and Provides 12 Precision, Low Skew LVDS Output Copies
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• Ultra-low Jitter Design:- 130 fs RMS Phase Jitter (Typ)- 0.7 psRMS Crosstalk Induced Jitter
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• Unique, Patent-pending 2:1 Input MUX Provides Superior Isolation to Minimize Channel-to-Channel Crosstalk
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• CLK0 Input Features a Unique, Patent-pending Input Termination and VT Pin that Accepts ACand DC-coupled Inputs (CML, LVPEC
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• 325 mV LVDS-compatible Output Swing
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• Power Supply: 2.5V ±5%
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CATALOG |
SY89113UMY COUNTRY OF ORIGIN
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SY89113UMY PARAMETRIC INFO
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SY89113UMY PACKAGE INFO
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SY89113UMY MANUFACTURING INFO
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SY89113UMY PACKAGING INFO
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SY89113UMY ECAD MODELS
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SY89113UMY APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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Thailand
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PARAMETRIC INFO
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Type |
Fanout Buffer |
Fanout |
1:12 |
Number of Outputs per Chip |
12 |
Input Logic Level |
CML|CMOS|HSTL|LVDS|LVPECL|TTL |
Output Logic Level |
LVDS |
Minimum Operating Supply Voltage (V) |
2.375 |
Maximum Operating Supply Voltage (V) |
2.625 |
Minimum Output Frequency (MHz) |
1000 |
Minimum Input Frequency (MHz) |
1000 |
Output Signal Type |
Differential |
Maximum Output Skew (ps) |
25 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical Operating Supply Voltage (V) |
2.5 |
Maximum Quiescent Current (mA) |
330 |
Number of Clock Inputs |
2 |
Spread Spectrum |
No |
Input Signal Type |
Differential |
Power Supply Type |
Single |
Configuration |
1 x 2:1 |
Maximum Propagation Delay Time @ Maximum CL (ns) |
1.2@2.375V to 2.625V |
Absolute Propagation Delay Time (ns) |
1.2 |
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PACKAGE INFO
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Supplier Package |
QFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
44 |
Lead Shape |
No Lead |
PCB |
44 |
Tab |
N/R |
Package Length (mm) |
7 |
Package Width (mm) |
7 |
Package Height (mm) |
0.85(Max) |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Description |
Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
260 |
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ECAD MODELS
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APPLICATIONS |
• Multi-processor Server |
• SONET/SDH Clock/Data Distribution |
• Fibre Channel Distribution |
• Gigabit Ethernet Clock Distribution |
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