
|
|
• General Purpose SMT Chip Tantalum Series
|
• 100% Surge Current Tested
|
• 17 Case Sizes Available, Standard and Low Profile Down to 1mm Maximum Height
|
• CV Range: 0.10 - 2200μF / 2.5 - 50V
|
• J-Lead Construction
|
|
| CATALOG |
TAJD337K010RNJ COUNTRY OF ORIGIN
|
TAJD337K010RNJ PARAMETRIC INFO
|
TAJD337K010RNJ PACKAGE INFO
|
TAJD337K010RNJ MANUFACTURING INFO
|
TAJD337K010RNJ PACKAGING INFO
|
TAJD337K010RNJ ECAD MODELS
|
TAJD337K010RNJ APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Mexico
|
Japan
|
El Salvador
|
United States of America
|
Czechia
|
|
PARAMETRIC INFO
|
| Capacitance Value |
330uF |
| Voltage |
10VDC |
| Tolerance |
10% |
| Ripple Current (mA) |
408 |
| Case Code |
D |
| Leakage Current (uA) |
33 |
| Equivalent Series Resistance (Ohm) |
0.9 |
| Case Style |
Molded |
| Fail Safe with Built-in Fuse |
No |
| High Shock and Vibrating |
Yes |
| Temperature Range @ Derated Voltage (°C) |
85 to 125 |
| Polarity |
Polar |
| Construction |
Flat |
| Operating Temperature (°C) |
-55 to 125 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Equivalent Series Resistance Type |
Standard |
| DC Rated Voltage (VDC) |
10 |
| Negative Capacitance Tolerance (%) |
-10 |
| Positive Capacitance Tolerance (%) |
10 |
| Surge Test Option |
No Surge |
| Minimum Storage Temperature (°C) |
-10 |
| Maximum Storage Temperature (°C) |
50 |
| Maximum Dissipation Factor (%) |
8 |
| Type |
Solid |
| Equivalent Series Inductance (nH) |
2.4 |
| Package Region |
World Wide |
| Special Features |
Low Profile |
| Test Frequency (Hz) |
120 |
| Fixed/Variable |
Fixed |
| Maximum Terminal Width (mm) |
4.5 |
|
|
PACKAGE INFO
|
| Package/Case |
7343-31 |
| Mounting |
Surface Mount |
| Termination Style |
Inward L |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
7.3 |
| Product Depth (mm) |
4.3 |
| Product Height (mm) |
2.9 |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Product Weight (g) |
0.29 |
| Length Tolerance (mm) |
±0.2 |
| Depth Tolerance (mm) |
+0.2|-0.1 |
| Height Tolerance (mm) |
+0.2|-0.1 |
| Diameter Tolerance (mm) |
N/R |
| Number of Terminals |
2 |
| Size (mm) |
7.3 X 4.3 X 2.9 |
| Maximum Product Length (mm) |
7.5 |
| Maximum Product Depth (mm) |
4.5 |
| Maximum Product Height (mm) |
3.1 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Alloy 42 |
| Shelf Life Period |
No Limitation |
| Number of Wave Cycles |
3 |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Anode Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
• General Low Power DC/DC and LDO
|
• Entertainment / Infotainment Systems
|
• Height Restricted Design
|
|